Exnodes

Elevate chip yield at the leading edge

[Exnodes @exnodes]

Why isn't your process yield where you need it to be? https://t.co/7xiMkpnN3d

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https://t.co/athedSCfYU

[Exnodes @exnodes]

https://t.co/athedSCfYU

[Exnodes @exnodes]

https://t.co/athedSCfYU

[Exnodes @exnodes]

Multi-Bridge Channel FETs improve transistor speed, density & power consumption as #nanosheets can be #stacked vertically unlike fins of FinFETs

https://t.co/2ZNXrR8w0W

[Exnodes @exnodes]

“Spectral reflectometry… improves etch stop accuracy for trench etch, buried gate recess, and other applications where there is no etch stop layer. Process data is collected in situ, in real time, and non-destructively” - @LamResearch

[Lam Research @LamResearch]

We live in a #DataDriven world & Richard A. Gottscho, Lam’s CTO, has a lot to say about it. In our latest blog post, he explores the challenges that the #semiconductor industry faces when it comes to utilizing big data. https://t.co/MQaYnuNzjx

[Exnodes @exnodes]

"Replacing DRAM with MRAM could... enable computers to start instantly without waiting for software to boot up" - @KLAcorp

[KLA @KLAcorp]

What is MRAM and why is it becoming more attractive to the semiconductor industry? Learn more about #MRAM as a promising universal memory and KLA’s metrology solutions to manufacture this exciting technology.
https://t.co/xbX6RRBjh3 @SemiEngineering

[Exnodes @exnodes]

"Edge Intelligence: the approach where the data is processed at the point of data collection enabling autonomy in decision making and autonomy in energy use"

[Applied Materials @Applied4Tech]

Helping the industry develop new chip architectures that move memory closer to compute can enable more intelligent edge devices and more efficient processing of data, says Applied's Michael Stewart in his latest blog. https://t.co/zmKvKAJI93

[Exnodes @exnodes]

“Sense.i also features autonomous calibration & maintenance capabilities… that allow the tool to self-adapt to minimize process variations” - @LamResearch

[Lam Research @LamResearch]

We’ve revolutionized the #chipmaking process with our new plasma etch #technology & system solution, Sense.i™. Read more in our latest blog post: https://t.co/qz0UPzmTBA #semiconductors

[Exnodes @exnodes]

"Working with large data sets has meant compromise: either processing a small subset of the data quickly, or facing long waits for more comprehensive results. Computational storage resolves this dilemma by pushing intelligence to where the data resides" - @SamsungSemiUS

[Samsung Semiconductor US @SamsungSemiUS]

Don't wait to embrace the advantages of computational storage. Learn more about Samsung SmartSSD® drives in our blog and at #OCPSummit20 in booth B25

[Exnodes @exnodes]

Lam's new EUV dry resist enables lower dose & increased resolution to increase productivity & yield of next gen computing chips. Also, by utilizing 5-10x less materials, @LamResearch’s dry resist is cost-effective & sustainable!

[Lam Research @LamResearch]

#LamResearch is excited to share our #technological breakthrough for extreme ultraviolet (#EUV) patterning, discovered in collaboration w/ @ASMLcompany & @imec_int – learn more via our latest blog post: https://t.co/O9a4XcyU74

[Exnodes @exnodes]

"[To support architectural complexity, scaling, new processes & materials in leading-edge, it is necessary to achieve tight tolerances & eliminate ever smaller defect sizes. This drives extreme quality control of buried features, materials, process equipment, EUVL]"- @KLAcorp

[KLA @KLAcorp]

Manufacturing advanced ICs is complicated and the complexity will only grow as we move forward. Learn more about the extreme quality innovations needed to support future-node ICs in this @SemiEngineering article by KLA’s Ben Tsai and Cathy Perry Sullivan. https://t.co/9F3bOcOyqC

[Exnodes @exnodes]

On-board inspection modules are paving the way for next-generation process control.

[Exnodes @exnodes]

With #sensitivity as high as 9.8 nm at 9 wph; with #throughput as fast as 116 wph at 16 nm; with #falsecount as low as 1 per wafer;

[Exnodes @exnodes]

With #data as feature-rich as 25+ pixels per defect; with wavelength as #safe as the visible; and with foot-print as #compact as a process chamber,

[Exnodes @exnodes]

“A holistic understanding of defectivity in SiC device fabrication is required” - @LamResearch

“Most of the challenges are related to the quality of the SiC material” - @Applied4Tech

https://t.co/3dGEoe2GfB

[Exnodes @exnodes]

“[With 1000s of chips/vehicle, there is a new focus on quality… Chips with a higher probability of reliability problems are more likely to have latent defects... An effective way of finding chips with latent defects is to decrease parametric & defectivity margins]” - @KLAcorp

[KLA @KLAcorp]

Read more about the extreme quality semiconductor manufacturing innovations needed to support automotive reliability in this @SemiEngineering article by KLA’s Ben Tsai and Cathy Perry Sullivan. https://t.co/YFDa7Tt6oF

[Exnodes @exnodes]

Eliminating photoresist exposure during inspection is another reason why sub-10 nm on-board wafer inspection with visible wavelengths is proving to be a game changer for next-generation process control.

https://t.co/EvrDtUVPHL

[Exnodes @exnodes]

The most advanced sections of semiconductor fabs are illuminated with yellow lights. Known to insiders as “litho cells”, this is where chipmakers print nanoscale circuits by exposing photoresist layers to ultraviolet light patterns.

[Exnodes @exnodes]

To maximize yield, chipmakers carefully inspect both sides of wafers in litho cells with optical inspection tools. When given the choice between using ultraviolet or visible light for such optical inspection, what wavelength would chipmakers choose?