The ASM Electronic Device Failure Analysis Society (EDFAS), an affiliate of @ASMInternatnl, fosters education & communication in the failure analysis community.
Coming soon - an ASM FREE webinar with @LeicaMicro! Join us May 4 to learn about the benefits of a digitally enhanced inspection workflow using Exalta. Register now: https://t.co/SpXuY38A6h #ASMWebinars#microscopy
The #ISTFA2021 Call for Papers deadline extended to April 26! Abstracts are being solicited on a variety of topics! Click here to learn more: https://t.co/yVT6D4GYGz
The #ISFTA2021 abstract submission deadline is fast approaching! Share your experiences and advance the industry and your career and submit your abstract now! Deadline is April 12. https://t.co/sptHhROTrq
Computer vision and machine learning systems for microstructural characterization and analysis are used for a variety of image analysis tasks, including image classification. Read more from the February/March issue of AM&P #magazine: https://t.co/jBYDwYqAxj
📢 Coming soon - an ASM FREE webinar with @LeicaMicro! Join us April 6 to learn how to easily prepare micro targets to an excellent quality finish for high resolution electron microscopy analysis. Register today! https://t.co/bmYxOfFmyM #ASMWebinars#microscopy#webinar
The EDFAS Board of Directors 2021 Call for Nominations is due April 16. There are expected to be 2 open positions and any member of EDFAS in good standing is encouraged to nominate themselves or another member. Learn more: https://t.co/C5RMngMOVF
Holograms could be the solution for better 3D visualization. MIT researchers have developed a new way of producing holograms near instantaneously using a laptop instead of a supercomputer. Read more: https://t.co/6OFYT2w1cv
#3Dprinting#Holograms#MIT
🚨 One month deadline alert! The call for abstracts for #ISTFA2021 closes April 12. A variety of topics are being solicited. For the full list and to submit visit: https://t.co/JR1w525Smb
Researchers at the Phoenix project at @TUeindhoven, Netherlands, developed a swarm of sensor nodes to explore unknown environments that are difficult for humans to access, like underground liquid-filled environments such as deep oil wells. Read more: https://t.co/LZUDcJISf6
The semiconductor supply chain has been in upheaval, w/ chip shortages impacting the automotive industry globally. An executive order was issued to review semiconductors & batteries & the sectors utilizing them in hopes of strengthening the supply chain. https://t.co/dW36E9yejo
There's still time to submit your abstract for #ISTFA2021! From 2.5D & 3D Devices Failure Analysis to Yield & Reliability Enhancement, position your research to get noticed! The submission deadline is April 12. For a full list of topics & to submit visit: https://t.co/YNO6zIkR8T
EDFAS is seeking nominations for both the Lifetime Achievement Award & the President's Award. If you know a fellow member who has devoted their time to the EDFAS industry or who has had exceptional service, consider nominating them. Deadline is March 1. https://t.co/poRCBb4100
The ISTFA 2020 Conference Proceedings have been added to the ASM Digital Library! The theme for 2020 was The Rise of MEMS and 3D Failure Analysis. Click here to view the full volume: https://t.co/Zu51iCBk7H
A team of engineers at @CUBoulder have developed a new device you can wear like a ring or bracelet that harvests energy from your own body heat, essentially transforming the human body into a biological battery. Read more: https://t.co/XmXDsJMzus
EDFAS is seeking nominations for the Lifetime Achievement Award & the President's Award. If you know a fellow member who has devoted their time to the EDFAS industry or who has had exceptional service, please consider nominating them. Deadline is March 1. https://t.co/5jL6R50BG9
Thanks to those who attended the #EDFASUserGroupSeries! It was a successful event & we couldn’t have done it w/out our sponsor! ULTRA TEC designs & manufactures advanced equipment to enable Electronic Failure Analysis & related applications. To learn more: https://t.co/zyF92AQGwD
The last session of #EDFASUserGroupSeries is the System on Package User Group. SoP certainly increases reliability risks & failure analysis complexity that many are likely encountering. Let's discuss it! Register here: https://t.co/pSgQhJaD4T
Today's #EDFASUserGroupSeries, Contactless Probing & Nanoprobing User Group, will include discussion on a variety of topics related to optical probing techniques for fault analysis, as well as nanoprobing & scanning probe microscopy. Register here: https://t.co/jv1WCJdiVV
Today's #EDFASUserGroupSeries will discuss sample preparation and its role in failure analysis within the semiconductor industry. The Sample Prep User Group session starts at 11:30 a.m. est. Register here: https://t.co/dTtyJCczfm