CSMH

CSMH, a wide bandgap Semiconductor Material company specialized in: diamond wafer, diamond heat sink, GaN & Diamond and PVD AlN template

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Breaking news! Peking University has succeeded in growing crack-free thick GaN films with high-quality AlN On Si produced by us, CSMH! Solve the key problems of the growth of GaN on Si substrates!

We're excited to share with you a new article from Applied Physics Express that

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Meet CSMH at CIOE 2026 in Shenzhen and look forward to connecting with companies, researchers, and technology experts from across the global photonics and semiconductor industries.
📅 September 9–11, 2026
📍 Shenzhen World Exhibition & Convention Center
🏢 Hall 4 | Booth 4D205

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As AI chips push 2.5D/3D packaging to the thermal limit, cooling is becoming the next challenge.
At CSMH, Diamond on Si brings diamond’s exceptional thermal performance together with silicon compatibility—making advanced cooling more practical, scalable, and ready for production.

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CSMH Diamond on Si technology integrates high-quality diamond films with silicon substrates, delivering scalable thermal management solutions for advanced 2.5D/3D packaging and next-generation AI computing architectures.
#diamond#CSMH#Diamond on Si

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CSMH supplies premium AFM probes with micro-nano processing tech. Sharp ~5° tips ensure high resolution, deep trench detection, 50% longer service life and precise sample positioning.

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Featuring revolutionary materials and an innovative Si-on-Si bonding design, CSMH’s proprietary Diamond-on-Si thermal solution effectively tackles heat dissipation challenges of GPUs and AI chips.
#DiamondOnSi, #SiliconSubstrate, #ThermalSubstrate,#ChipCooling,#CSMH

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CSMH’s self-developed Diamond on Si tech delivers powerful cooling via material & bonding breakthroughs, slashing GPU/CPU junction temp. Validated by global semiconductor clients and mass-produced. Contact us for cooperation!
#AI PC# #Diamond on Si #Diamond #AIChip #CSMH

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our TDTR uses a non-contact optical pump-probe technique that measures thermal properties through surface reflectivity changes. It delivers precise, reliable data for ultra-high thermal conductivity materials — including diamond, SiC, and nanoscale films. #TDTR #Diamond #CSMH

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Diamond heat sinks — engineered for optical chips��� toughest thermal challenges.

With an ultra-high thermal conductivity of 2000 W/(m·K) and top-tier heat dissipation,diamond heat sinks are the ultimate thermal solution for optical chips.

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‌Introducing Cu-Diamond Package Housing – The Ultimate Thermal Solution for Optical Chips
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Cu-Diamond is a revolutionary copper-diamond composite material, expertly engineered to combine diamond’s ultra-high thermal conductivity with copper’s superior process compatibility.

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New product launch alert - Introducing CSMH's Diamond Probes.
With a focus on customization and quality, at CSMH we offer more cost-effective Diamond Probes!We also have extensive experience in micro-nano processing and accept customized processing from customers.

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CSMH has achieved a major milestone in the development of wafer bonding solutions：custom single-crystal diamond with ultra-smooth surface(≤ 0.5 nm),1–2 inch polycrystalline diamond with smooth surface(≤ 1 nm) and warpage (<10 μm).

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As the festive season wraps us in warmth , the entire team at CSMH Diamond Materials want to send you all the coziest wishes for a joyful, peaceful holiday—filled with lovely moments with the people you care about.

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For high-end optical systems, CSMH delivers diamond windows with ultra-high thermal conductivity, which can achieve 2000 W/(m·K).CSMH also offers one-stop optical management solutions: electrode-integrated diamond, laser processing, target coating, and customized flange windows.

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CSMH has independently developed thermal conductivity testing machine, solving the problems of cost and efficiency in materials testing!

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Happy Thanksgiving Day !
The deepest gratitude to our partners, clients, and dedicated team: your trust and support drives our pursuit of cutting-edge diamond solutions.
Together, we’re pushing the boundaries of what’s possible—here’s to more breakthroughs ahead!

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“Copper-Diamond + Liquid Cooling-The Ultimate Thermal Management Solutions”is the title of Marketing Director’s presentation at MSDC 2025, tomorrow.
Take the opportunity to meet CSMH’s professional team, and hear CSMH last results on Copper-Diamond Thermal Management Solutions.

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CSMH Launches Thermal Conductivity Testing Machine,redefining Cost-Efficiency in Material Testing!
CSMH has developed a low-cost, easy-to-operate thermal conductivity testing Machine and system, which can provide a precise and efficient thermal performance testing solution.

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Don’t Miss MSDC 2025 (Nov 20-21) – Connect with CSMH at Booth 03!As a  leading innovator in diamond solutions, CSMH is excited to showcase our ultimate thermal management solutions: copper diamond. We can’t wait to collaborate!

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CSMH's Diamond composite materials: Combining Ultra-High Thermal Conductivity with Metal Advantages to Empower Industrial Upgrading
CSMH is revolutionizing thermal management with its high-reliability brazing tech—successfully bonding W, Cu and other metals to diamond .