Mark LaPedus

Executive Editor -- Semiconductor Engineering.

[Mark LaPedus @MarkLaPedus]

Paving The Way To Chiplets https://t.co/u8PmFCxb8R

[Mark LaPedus @MarkLaPedus]

Photomask Shortages Grow At Mature Nodes https://t.co/OhNVS7bmIv

[Mark LaPedus @MarkLaPedus]

Highly Selective Etch Rolls Out For Next-Gen Chips https://t.co/GOKDEGdK91

[Mark LaPedus @MarkLaPedus]

Week In Review: More Intel fabs; earthquake; U.S. materials; foundry rankings. https://t.co/BwnROmRs0c

[Mark LaPedus @MarkLaPedus]

Chiplets Enter The Supercomputer Race
Nations compete on speed using very different compute architectures. https://t.co/pFcdCeKCvh

[Mark LaPedus @MarkLaPedus]

Week In Review: Apple’s packaging technology; fab education; test flows; CapEx. https://t.co/RpS4568Gj1

[Mark LaPedus @MarkLaPedus]

Week In Review: Chiplet consortium; 3D XPoint woes; eBeam; 2nm wars. https://t.co/JBgl7knXjA

[Mark LaPedus @MarkLaPedus]

Week In Review: UMC’s 22nm fab; more fabs; flexible chips; Russia sanctions. https://t.co/B3MuPtWgkn

[Mark LaPedus @MarkLaPedus]

Transistors Reach Tipping Point At 3nm https://t.co/5Qk9xAWnFr

[Mark LaPedus @MarkLaPedus]

2022 Chip Forecast: Mixed Signals https://t.co/ziGFO2Kymg

[Mark LaPedus @MarkLaPedus]

Unsolved Issues In Next-Gen Photomasks https://t.co/xHvWKvSVrp

[Mark LaPedus @MarkLaPedus]

Week In Review: Intel buys Tower; Infineon fab; India fab; Amkor CapEx; analytics; earnings. https://t.co/e5WAG61qLU

[Mark LaPedus @MarkLaPedus]

Silicon-Based Power Semis Face Challenges https://t.co/D2Hw0NRVa8

[Mark LaPedus @MarkLaPedus]

Technology Advances, Shortages Seen For Wire Bonders https://t.co/ypOYJ9reMv

[Mark LaPedus @MarkLaPedus]

Manufacturing Bits: Strong plastics; hard plant composites; tough adhesives. https://t.co/WYpAuGhard

[Mark LaPedus @MarkLaPedus]

Week In Review: Selective etch; ASE’s CapEx; NAND fab snafu; EU Chips Act. https://t.co/dwlteCGGkq

[Mark LaPedus @MarkLaPedus]

Manufacturing Bits: Design tool for solid-state batteries; quantum batteries; fiber batteries. https://t.co/N57a1M5Bmz

[Mark LaPedus @MarkLaPedus]

Week In Review: Quebec hi-tech hub; scrapped wafer merger; talent gap; Wi-Fi trends. https://t.co/ctwW9bFcUB

[Mark LaPedus @MarkLaPedus]

Manufacturing Bits: Fab equipment cybersecurity; cyber prevention; cyber education. https://t.co/0I2YY00qT4

[Mark LaPedus @MarkLaPedus]

Next-Gen 3D Chip/Packaging Race Begins https://t.co/KSq08ZxowT