Space Lasers

[Space Lasers @SpaceLaserss]

@downbadbears He's a cupcake 💅

[Space Lasers @SpaceLaserss]

@captaincaleb18 Joolery

[Space Lasers @SpaceLaserss]

@captaincaleb18 Tik tok all-pro

[Space Lasers @SpaceLaserss]

@captaincaleb18 Dudes a gay

[Waken Minds 𓂀 @wakenminds]

Someone is not telling us the truth about our history..

[Space Lasers @SpaceLaserss]

@nebuchadnigga jewish propaganda

[Space Lasers @SpaceLaserss]

@diesel3825 @MyGolfSpy Hey Claude — humans don't use these —

[Tyler Oliveira @tyleraloevera]

🚨 Here is the full 73 minute long documentary exposing New Jersey's Jewish Invasion...

Since my Patreon has been shut down, like and share on X to support our work!

[𝑮𝒆𝒏𝒁𝑷𝒂𝒕𝒓𝒊𝒐𝒕 @GenZPatriotz]

Every single person on Earth should know the following terms:

- The Kalergi Plan
- The Talmud
- The Holodomor
- Usury and Central Banking
- AIPAC
- The Balfour Declaration
- The Greater Israel Project

[Jukan @jukan05]

[EXCLUSIVE] SK HYNIX CONSIDERS INTEL FOR NEXT-GENERATION HBM BASE DIES

SK hynix is moving to diversify the foundry suppliers for the base dies used in high-bandwidth memory (HBM), which is built by vertically stacking multiple memory dies.

The company is reportedly considering outsourcing a portion of the base-die production for HBM4E, the seventh generation of HBM, to Intel Foundry. Until now, SK hynix has relied entirely on TSMC for outsourced base-die production.

The move is seen as an effort to establish a multi-vendor foundry strategy, reducing supply-chain concentration on TSMC while also strengthening SK hynix’s bargaining power on pricing.

According to industry sources on August 31, SK hynix is pursuing a plan under which base dies for HBM4E could be manufactured by both TSMC and Intel, potentially beginning as early as the HBM4E generation.

The base die sits at the bottom of an HBM stack and functions as a controller chip that supports and manages the overall structure. It is also commonly referred to as a logic die. The base die is responsible for the high-speed interface that connects HBM with external processors such as GPUs and CPUs.

Up through HBM3E, SK hynix manufactured its base dies using its own processes. However, as successive HBM generations have placed greater importance on the logic, control functionality, and performance of the base die, SK hynix began working with TSMC to manufacture base dies starting with HBM4. SK hynix’s HBM4 products currently in mass production use base dies manufactured on a TSMC 12nm-class process.

The key issue is the cost burden associated with the base die. According to industry sources, the TSMC-produced base die used in HBM4 is estimated to cost three to four times as much as the core dies—the DRAM dies stacked above the base die that directly store data—which SK hynix manufactures using its 10nm-class fifth-generation 1b process.

The base-die cost burden is expected to increase further with HBM4E. Because HBM products are heavily covered by long-term supply agreements (LTAs), it is also difficult for SK hynix to immediately pass higher foundry costs on to customers through higher product prices.

For this reason, industry observers believe that if Intel ultimately joins SK hynix’s base-die supply chain, the company would gain additional options in terms of both cost competitiveness and supply stability.

The move is also interpreted as part of a longer-term strategy to diversify a supply chain currently concentrated on TSMC. Beginning with HBM4, “custom HBM”—in which the base-die design is tailored to the architecture and performance requirements of individual customers’ AI accelerators—is becoming increasingly important.

For SK hynix, this creates a need to move away from an ecosystem concentrated around specific customers and foundries and broaden its ability to collaborate with a wider range of AI chip companies.

There is also speculation that SK hynix’s cooperation with Intel could eventually expand beyond base-die manufacturing into advanced packaging.

At Hot Chips, the high-performance semiconductor and computing architecture conference held in Silicon Valley, Lee Jae-sik, vice president of package engineering at SK hynix America, said the company is evaluating and comparing major advanced packaging technologies, including TSMC’s CoWoS-S and CoWoS-L as well as Intel’s EMIB.

$INTC

[Space Lasers @SpaceLaserss]

@Bears_Hype_Man Spider legs

[Space Lasers @SpaceLaserss]

@captaincaleb18 Same person

[Space Lasers @SpaceLaserss]

@captaincaleb18 He's like Neon Dieon after he lost his toes

[Space Lasers @SpaceLaserss]

@clayharbs82 Is it opposite day? If by deep you mean bombed and depleted, then yes.

[Space Lasers @SpaceLaserss]

@AdamGLost Can't feed a family of runts. Takes huge shits. Hot though

[Space Lasers @SpaceLaserss]

@Dylan_Morri Seems like the current crystal-growing players purposely limit supply so as to boost prices and demand. What does a world with supply greater than demand look like? Hmmmm

[Space Lasers @SpaceLaserss]

@AdamHoge Waived = under 4 seasons. He goes on the waiver wire. Any team can claim him, worst record picks first, and he has no say.

Released = 4+ seasons. Instant free agent. He picks where he signs.

Free agency just means nobody holds his rights, so he chooses.

[Space Lasers @SpaceLaserss]

@AdamHoge What's the difference between waived and released?

[Space Lasers @SpaceLaserss]

@Bill_Bychowski @AdamHoge Still not sure what the differences are but thank you. Waived are waived and released get free agency? What does that mean? I will Ask Jeeves

[Space Lasers @SpaceLaserss]

@AdamSchefter Micah Parsons is a SISSY