Stan.h

Tech fan since early 80s, at Bull, Ex Intel focused in DC HW, ideas and opinions in this tweeter feed only engage myself and not the company I work for.

[Stan.h @StanTechAddict]

May 11th, 1992: Nathan F. Myhrvold to Bill Gates
"Topics for System Strategy"
My guess is that the following things will happen to Intel:
Is this good for us? The answer is YES! That this is an extremely good thing for anybody in the x86 world except Intel https://t.co/Wv0STa84ht

[Stan.h @StanTechAddict]

Great reading on power and cooling and networking challenges in AI racks within the OCP perspective.

https://t.co/xrcqfuslTY

[Stan.h @StanTechAddict]

GLM-5.2 AgentX on AMD Instinct MI355X: Boosting Throughput and Interactivity
(lots of PR to SGlang :-))

https://t.co/FWfg5N5iEE

[Stan.h @StanTechAddict]

(Gemini) “AMD prévoit de proposer des bibliothèques capables de basculer dynamiquement entre le FP64 » et « la méthode Ozaki ne résout pas les besoins de 90 % des applications HPC traditionnelles »
https://t.co/FOM09k1GkJ

[Stan.h @StanTechAddict]

ZYFA: Speed and Accuracy of FP8 FlashAttention on AMD CDNA4

https://t.co/yl2c0lZZcY

[Ultra Accelerator Link @UltraAccelLink]

The #UALink Chiplet Specification 1.0 defines how an accelerator die connects to a UALink chiplet over #UCIe 3.0, so vendors can pair dies and chiplets from different vendors or reuse one chiplet across products. Read our blog to learn how it works: https://t.co/AmIGS0JFrH

[Stan.h @StanTechAddict]

@HotAisle NVIDIA already showed the NVL576 with a “multi-rack scale-up fabric” so why not ?

Anyway it’s a lot of money for a company which indeed has been quiet on its products.

[Stan.h @StanTechAddict]

OVH on aluminum vs copper heat exchanger.
https://t.co/QiUTAEVqgz

[Stan.h @StanTechAddict]

A 100 KW, AC to DC 800V LC Power Shelf from Megmeet is already cool, but look at the liquid couplers form factor, this is not UQD08 or such 😉

[Stan.h @StanTechAddict]

« #Bull is extending its European AI server production to #NVIDIA Vera Rubin Ultra NVL72 systems, planned for 2028, with trays produced in Europe and rack integration at its Angers factory — inaugurated Friday, Oct. 2. »

[NVIDIA AI Infrastructure @NVIDIAAIInfra]

France's AI ecosystem has moved from ambition to application, from the factory floor to orbit.

Ahead of #NVIDIAGTC Berlin, France-based companies are showing what agentic AI on NVIDIA infrastructure and open models looks like in production.

Read more on how France's ecosystem is delivering agentic computing at scale across industries spanning space, financial services, the public sector, scientific research, and more. ➡️ https://t.co/4cxjbyTryJ

[Stan.h @StanTechAddict]

@AustinSuttvguw I agree, like density. On this front OAC is at least 5U when VR NVL8 is only 2U, but OAC card TDP can be higher. Btw I haven’t seen 100% DLC OAC servers so far, but I guess nothing prevent it. Trade-off as usual.

[Stan.h @StanTechAddict]

First time I can see a GPU in OAC form factor. It supports >3.5 kW GPUs. Prototype from Intel #OCP

[Stan.h @StanTechAddict]

"The Unified Local profile extends UET to support local scale-up networks. Optimized for wire efficiency, small transactions, and compact implementation, the Unified Local profile supports write/read/atomic operations."

[Stan.h @StanTechAddict]

#UEC / Ultra Ethernet specification 1.1 are online.
https://t.co/R4wnsy1huA
If I rely on this extract, UE can now ne useb for scale-out AND scale-up. One to win them all (finally)?

[Stan.h @StanTechAddict]

#AMD #Verano, available in H1’27
Fairly big socket no?

[Stan.h @StanTechAddict]

#Bull and #AMD together with #Helios

[Stan.h @StanTechAddict]

#OCP Don’t mess with Direct Current say the company Phoenix Contact which deployed 700VDC 2 years ago.

[Stan.h @StanTechAddict]

#OCP : 800V and 3 options at #EATON : Side Power Racks, Power Center and MVSST. Great presentation on safety. Loved the joke on « EPO which could be the only protection against AI one day » 😅

[Stan.h @StanTechAddict]

Some nice products (❤️ the 800-50V DC/DC 10kW brick)

[Stan.h @StanTechAddict]

#OCP from 800V busbar down to 3.3V in one component… #LITEON

[Stan.h @StanTechAddict]

@_Nidouille_ Moi aussi, ils sont plutôt bon les gars de Wiwynn dans le cooling en générale. L’année dernière ils avaient montré un serveur de stockage liquide coolé et c’est encore plutôt rare.

[Stan.h @StanTechAddict]

#CPO in GPU by #Wiwynn and Diamond as thermal material ❤️

[Stan.h @StanTechAddict]

Diamond again now with #LITEON… seems there is a pattern at #OCP