thintronics

More Data. Faster

[thintronics @thintronicsCA]

The last mile of signal integrity has a physics problem. Stefan Pastine breaks down why today's dielectric materials are costing data centers 35 kilowatts per rack and $200K in extra silicon, and what Thintronics is doing about it.
https://t.co/9ii1d9rAQJ

[thintronics @thintronicsCA]

Signed a Letter of Intent with the Dept of Commerce for up to $50M under the CHIPS Act 🇺🇸
The money matters but it also confirms our tech is solid, and the substrate bottleneck we're solving is one the industry and the federal government, recognizes as one that really matters.

[thintronics @thintronicsCA]

Thintronics' Stefan Pastine published an oped in @cenmag on the role chemistry and materials science has to play in reducing AI's outsized energy appetite which is showing up on household bills and in utility commission elections.
https://t.co/7TuJfO9wQp

[thintronics @thintronicsCA]

We've relaunched our website, check it out.
https://t.co/EWWOcYuJav

[thintronics @thintronicsCA]

Thintronics' CTO Tristan El Bouayadi takes the floor at IMAPS.

[thintronics @thintronicsCA]

Great to see Tristan El Bouayadi, Thintronics CTO, at https://t.co/5N4ryv6FSe outlining how materials breakthroughs are fundamental to advances in packaging and next generation semiconductors.
https://t.co/4pbwuVdEuP

[Shahin Farshchi @Farshchi]

Semiconductor packaging used to be unsexy, not to mentioned dumb, but now it’s as innovative as the chips they house.

Today’s scarcity in chips and memory will be addressed by tomorrow’s advancecd packaging techniques.

I had the privilege of meeting with leaders in packaging from large and small companies across the semi landscape at the 2025 International Microelectronics Assembly and Packaging Society (@IMAPSorg ) conference.

We discussed co-packaged optics to to low-k dielectrics to hybrid bonding to through-silicon vias to heterogeneous integration of silicon and 3-5s.

As transistors shrink to a few atoms, its packaging and interconnect that’s going to keep us marching forward on Moore’s law:

[thintronics @thintronicsCA]

Schmidt speaking to some of the structural challenges facing the US grid and touching on the competition problem born of a lack of planning and investment in the US.
https://t.co/4pYKchH8Wc

[The AI Investor @The_AI_Investor]

Eric Schmidt says data centers need about 92 gigawatt more capacity, with almost no new nuclear projects.

[thintronics @thintronicsCA]

AI’s electricity demand is a challenge utilities can’t ignore, but subsidies aren’t the solution. https://t.co/iQetIDfKqO via @UtilityDive

[thintronics @thintronicsCA]

Thintronics is proud to announce that we've closed our Series A extension with the addition of M Ventures and TGVP. With phenomenal levels of insight and experience in semiconductors and materials innovation, these guys can help us deliver!
https://t.co/nz7fQ9Tnre

[thintronics @thintronicsCA]

At Thintronics we've been heads down on R&D but as we move towards commercialisation people are starting to talk about us. First up, an insightful piece in MIT Technology Review about the difference we are making.

https://t.co/JaZk7pRW3B

[thintronics @thintronicsCA]

We are a materials company in Berkeley, CA. We make high performance insulators for substrate, semi conductor packaging, AI data centers, RF, and we are hiring.
https://t.co/l45EUGZLrS