World leader in the design and manufacturing of high-performance and reliability miniaturized components
utilizing a unique 3D vertical interconnect technology.
Meet us at @ParisSpaceWeek, the international space business meeting event that will occur on 28th and 29th in Paris Orly.
We hope to see you booth C06 to discuss your projects needs.
Embedded World 2018 started this morning for 3 days, meet 3D PLUS team booth 3A-508. We are looking forward to working with you on your projects. #ew2018
3D PLUS partnered with QINETIQ to miniaturize the motor controller electronics and developed a module embedding the necessary electronic components, and a redundancy system is provided for each actuator. https://t.co/QqvbJZDu85
NEWS: QinetiQ signs €26.6m contract with @esa to produce new docking mechanism for the International Space Station https://t.co/PElEvyj09k #QinetiQresults
Be sure to visit @3D_PLUS_Space at (Booth A20) the Space Tech Expo in Bremen 24-26th October 2017. Live demo of the CMOS Space Camera. https://t.co/CPnvFvtym3