Hot Interconnects 2024 is right around the corner! We're honored and excited to be a part of the insightful panel with distinguished peers on the future of AI interconnects.
Our Founder & CEO Dr. Bardia Pezeshki will be there. Don't miss it!
Register 👉 https://t.co/0N9po76i5k
"We have already demonstrated the benefits of LightBundle links in data center, HPC, and ML/AI with bleeding edge power and density requirements." #innovation#semiconductor https://t.co/CpzLG8A66K
Avicena’s LightBundle technology provides an opportunity for GaN microLEDs to impact numerous key applications including HPC, AI/ML, sensors, automotive and aerospace #innovation#semiconductor https://t.co/T996FkP0CM
Avicena demonstrates ultra-fast microLED-array based interconnects for chip-to-chip communications at ECOC 2022 #semiconductor#innovation https://t.co/kOGPWS15wx
Avicena Raises $25 Million in Series A to Fund Development of High Capacity microLED-based Optical Interconnects #optical#connectivity
https://t.co/kqXWbL88yj
Avicena partners with @lumileds to demonstrate microLED-based LightBundle™ chip-to-chip interconnects with superior energy efficiency and bandwidth density. https://t.co/W9hq0aY3Y0
#semiconductor#innovation
Reinventing Chip-to-Chip interconnects; Avicena’s LightBundle™ interconnects achieve 10x – 100x power and density improvements over any alternative for 1 cm – 10 meter reach. https://t.co/2YUqBeAfJf