Bill

US stock investor, best record: 50x returns in one month, 20x in one year. stocks, options, crypto... Hoping to find an American girlfriend to marry.

[Bill @Bill7758]

@wallstengine This company frequently collapses; it seems to have a very wild operating style.

[Bill @Bill7758]

@CheddarFlow It expires in September—with over two months remaining—and a fluctuation of $90 against a price of $400 is not excessive.

[Bill @Bill7758]

$ASMPT has a market capitalization of only $10 billion, which is very small compared to others with market capitalizations starting at $300 billion.

It has only recently doubled in value, suggesting it has a certain position in this HBM capacity expansion.

The price increase is not significant, and the market capitalization is not large, so there should be room for growth.

It would be great to buy at a lower point.

[Bill @Bill7758]

Software, space communications, cloud computing, electricity—all that's trivial; ignore it all.

Focus only on hardware, only on storage, only on optical communications.

Trivialities will only hinder your ability to execute your strategy.

$GLW $KLAC $AMAT $SNDK $ASMPT

[Bill @Bill7758]

$AMAT did indeed rise by +10%, did you buy it?

[Bill @Bill7758]

$AMAT will rise +10% today?

[Bill @Bill7758]

HBM Supply Chain: Equipment & Material Partners for SK Hynix and Samsung (2026 Edition)

The battle for High-Bandwidth Memory (HBM) leadership between SK Hynix and Samsung Electronics is no longer just a war between two chipmakers—it has evolved into a clash of global supply chain alliances.

Because HBM requires precise Through-Silicon Via (TSV) etching and high-density advanced packaging (3D stacking), both giants have aggressively onboarded a specific "inner circle" of equipment and material partners.

I. Core Equipment Suppliers

The absolute bottleneck in HBM production is stacking DRAM dies like a skyscraper while maintaining perfect alignment and thermal management. This is executed by Advanced Bonders.

1. Advanced Bonding (TC & Hybrid Bonders)

Hanmi Semiconductor (042700.KS): The Backbone of SK Hynix
Hanmi is the biggest winner of the HBM boom. It supplies the proprietary Dual TC Bonder (Thermal Compression) that allowed SK Hynix to achieve industry-leading yields in HBM3E. Hanmi has just rolled out its next-gen "Wide TC Bonder" specifically for 16-layer and 24-layer stacking.

$ASMPT (https://t.co/pRb7SRyaC6 / $ASMPF.US): Samsung’s Savior & Hynix's Secondary Source
To catch up with SK Hynix’s yield rates, Samsung broke its tradition of using in-house tools and aggressively integrated ASMPT’s TC bonding equipment. SK Hynix has also qualified ASMPT as its secondary supplier to diversify its supply chain.

Besi (BE Semiconductor Industries, $BESI.AS / https://t.co/n8Q01dPgPT): The King of Hybrid Bonding
As HBM moves into the HBM4/HBM4E generations (16 to 24 layers), traditional micro-bumps hit physical thickness limits. The industry must pivot to Hybrid Bonding (direct copper-to-copper molecular bonding without bumps). The Netherlands-based Besi holds a near-monopoly on high-end hybrid bonding tools, and both Samsung and SK Hynix are heavily investing in Besi's platforms for their 2026–2027 nodes.
2. Front-End, Thinning & TSV Processing

DISCO Corporation (6146.T / $DSCSY ): HBM requires DRAM wafers to be ground down to the thickness of a human hair (~30 micrometers). Japan's DISCO virtually monopolizes the global market for ultra-precision wafer thinning and dicing saws.
Lam Research ( $LRCX ) & Applied Materials ( $AMAT ): These US tech titans provide the high-aspect-ratio etching and electroplating tools required to drill and fill millions of microscopic TSV (Through-Silicon Via) vertical copper pillars.

Tokyo Electron (TEL, 8035.T / https://t.co/Y6FRxFVYfG): Supplies advanced coater/developers and thermal processing units essential for front-end processing of HBM base dies.
II. Core Material Suppliers

Because Samsung and SK Hynix opted for different packaging technologies for their mainstream HBM lineups, their material supply chains diverge significantly.

1. Advanced Packaging Encapsulation (MR-MUF vs. NCF)
SK Hynix Ally: Resonac Holdings (4004.T / https://t.co/8EmQFNQtyJ - Formerly Showa Denko)
SK Hynix uses MR-MUF (Mass Reflow Molded Underfill), a process where an entire stack of chips is soldered at once, and a liquid compound is injected to fill the gaps. Resonac is the exclusive/primary supplier of this specialized liquid epoxy encapsulation material, acting as a critical choke point for SK Hynix's HBM capacity.
Samsung Ally: Samsung SDI (006400.KS) & DNP (7912.T)
Samsung utilizes NCF (Non-Conductive Film), placing a thin solid film between each DRAM layer before pressing them together. Samsung relies heavily on its affiliate Samsung SDI and Japan's DNP (Dai Nippon Printing) to secure these advanced films.

2. Substrates and Baseline AI Hardware Infrastructure

Kingboard Laminates ( $01888 ): As AI clusters scale up, HBM modules must be connected via ultra-high-layer PCBs and substrates. Kingboard's proprietary HVLP4 (Hyper Very Low Profile) copper foil has faced a global supply deficit in 2026, prompting direct supply-locking coordination from GPU designers like Nvidia.

III. The Historic 2026 Mega-Expansion Partners

On June 29, 2026, the South Korean government hosted a historic presidential briefing outlining a massive 800 trillion won ($520 billion) joint mega-cluster investment between Samsung and SK Hynix. This project aims to double Korea's DRAM capacity within five years.

Key infrastructure and strategic ecosystem partners for this massive buildout include:
Taiwan Semiconductor Manufacturing Co. (TSMC, $TSM ): The ultimate HBM4 alliance. SK Hynix has officially solidified its partnership with TSMC to fabricate the advanced 5nm/7nm custom Base Dies (Logic Foundations) for HBM4, which will then be packaged directly onto Nvidia's next-gen architectures.

Naver (035420.KS), SK Telecom (017670.KS), & GS Group (078930.KS): As part of the same 2026 megaproject briefing, these internet and telecom giants have partnered to deploy 18.4 Gigawatts of AI data center infrastructure to natively consume and stress-test the new HBM production lines.

[Bill @Bill7758]

$AMAT will rise +10% today?

[Bill @Bill7758]

To be honest, for a company like $CBRS , the more reasonable scenario would be for them to increase their losses.

The fact that they've achieved increased revenue, customers, and profits is already far beyond expectations; I don't understand why the market interprets it this way.

They're an innovative company, working on the fringes of human understanding, and the market should be more tolerant of them.

If their technology succeeds, like $NVDA current market capitalization of $5 trillion, what value will be left for you if you buy in then?

[Bill @Bill7758]

The entire hardware sector is down, including storage. $MU and $SNDK .

$Hynix keeps crashing, causing panic among investors.

Any hardware stock will likely rise for a day before falling back.

Let's see if funds can continue to flow into the software sector; software stocks have already fallen significantly and are quite low. $NOW $APP $PLTR

[Bill @Bill7758]

Will $IBM 's stock price reach 280 today?
Please...
Give me some good news! #options

[Bill @Bill7758]

Despite such a significant positive development for $IBM today, the market barely reacted. Logically, a 5% increase wouldn't be unreasonable. Perhaps everyone's attention was drawn to $SNDK and $MU . Options for 280 are only 0.05, incredibly cheap! A great opportunity for high-risk, high-reward plays. #stockstobuytoday

[Bill @Bill7758]

#SKHynix has seemingly manipulated global stock markets.

when $Hynix falls, global #stock markets fall.
when $Hynix rises, global #stock markets rise.
$MU and $SNDK wouldn't rise when $Hynix falls, right?

But lately, South Korea seems to be causing Hynix's stock price to fluctuate from time to time.

Can you guess why?

[Bill @Bill7758]

Buy at the close and sell at the open every day, repeating this daily, and you can make huge profits. With $MU $SNDK , who knows what the principle behind this is? Can you still do this now? Has anyone tried it?

[Bill @Bill7758]

You're the first person to comment on my x post, thanks

[Jade Knight @investwithjade]

@Bill7758 Took a lotto $277.5 for $0.07 🤞🏽

[Bill @Bill7758]

Despite such a significant positive development for $IBM today, the market barely reacted. Logically, a 5% increase wouldn't be unreasonable. Perhaps everyone's attention was drawn to $SNDK and $MU . Options for 280 are only 0.05, incredibly cheap! A great opportunity for high-risk, high-reward plays. #stockstobuytoday

[Bill @Bill7758]

Capital flows into $DRAM

[naiive @naiivememe]

Stocks down
Crypto down
Gold down
Real estate down

Where is the cash flowing into ?

[Bill @Bill7758]

It's true? $MU #MICRON $DRAM $MU

[Bill @Bill7758]

I don't think $MU should even be moving like this, but it's forced to follow $SKhynix stock price. The South Korean market is just too small while they're too big, which is causing these huge swings. There's honestly no reason for $MU to fluctuate, their earnings are bound to be great, and that's exactly what's creating this arbitrage opportunity. #stcoks $SNDK

[Bill @Bill7758]

Bloom Energy ($BE) has been quietly hitting new all-time highs lately, even as the broader indices pull back and tech stocks are swinging wildly. This one seems immune to the noise.
Any fresh catalysts? Is the upcoming earnings expected to crush it again thanks to massive AI/data center demand? Who’s got the latest intel?

[Bill @Bill7758]

Why not buy before the earnings report? No confidence?

[Gublo @Gubloinvestor]

I am going to add more $MUU and $DRAM after $MU reports its earnings tomorrow.

$MUU $1500
$DRAM $100