Unitree Robotics clears IPO review in just 73 days, setting a new record on STAR Market. With a $42B valuation and $4.2B fundraising, it becomes the first humanoid robot stock in A-shares. This milestone signals accelerated capital support for embodied AI and the entire robotics supply chain. #Unitree #HumanoidRobot
Chinese multimodal powerhouse StepFun just flipped the global AI table. Step 3.7 Flash delivers 400 TPS inference, matching 97% of Claude Opus 4.6 at 1/9 the cost. This isn't a simple update—it's a paradigm shift for the Agent era.
What should an Agent-era model look like? Give it a cockpit screenshot, old models just describe dials. Step 3.7 Flash selects the area, identifies instruments, plans steps, and guides a mouse through takeoff. From understanding to executing—that's the divide.
The competition has changed. As Agents enter production, latency and token costs explode. Step 3.7 Flash uses sparse MoE (196B total, 11B active) for 400 TPS. Speed is capability—faster means more iterations, better results in multi-step tasks.
Real tests: 12 messy receipts auto-extracted into Excel; Blender screenshot teaches you to delete a cube; Jianying interface locates export button, warns about 1080i and full-track export pitfalls. The model is on-site, working as your hands.
Even more impressive: emergent behavior. After writing frontend code, it switches to GUI to test rendering, then revises its own code. No one taught it this loop—it figured it out. That's what an Agent should be.
The Advisor strategy is the killer feature: small model executes, consults a larger model only at critical junctures. Result: $0.19 per task vs $1.76 for Claude Opus 4.6, with 97% coding capability. Two dimes vs two dollars—any team burning tokens gets it.
Step 3.7 Flash isn't a benchmark king, but it dominates the cost-efficiency frontier. Multimodal + extreme efficiency + near-zero cost makes it the foundation for production-grade Agents. Flash is no longer a budget option—it's the pragmatic force taking over the world.
BYD hits new monthly sales record in May: 383,453 units! Overseas sales surged 80.7% YoY, with cumulative deliveries exceeding 1.4 million in Jan-May. The NEV leader accelerates global expansion as market penetration rises. Supply chain momentum continues.
As far as I know, besides the LogicFolding-enabled EDA tool recently released by Peking University, Huawei has also been working on this technology internally, and several other vendors are developing similar solutions as well. So while it may appear that Huawei is the one introducing the product, the reality is that Chinese semiconductor companies and universities have already been exploring and advancing along this path for quite some time.
Necessity is the mother of innovation.
In one fell swoop, Huawei overtakes all in advanced Hybrid Bonding technology, with 2026 Kirin smartphones featuring 1.5 µm bond pitch 3D-stacked architecture.
Next year's Kirin chips will go down 1 µm pitch!
TSMC has only just moved to 6 µm SoIC, with their next step to 4.5 µm for 2030 products.
Intel's Foveros Direct is at 9 µm with Clearwater Forest this year.
16-36x denser interconnect enables Huawei's LogicFolding design, with more granular architectural splitting across the dies to optimize routing and shorten critical paths.
DeepSeek V4 explodes in first month: Flash hits 9.13T tokens monthly, three models total over 17T tokens! Agent systems (Hermes Agent at 10.8T) dethrone chatbots as token consumption kings, with single tasks triggering hundreds of LLM calls. Top models hit three walls: MoE communication, million-token memory, low-precision reliability. Ascend delivers universal support for GLM-5.1, MiniMax M2.7, and DeepSeek V4 on launch day. The battle for AI infrastructure entry points is on fire. #AIInfrastructure #LLM
Computex 2026 marks AI's shift from cloud to edge: PCs emerge as the prime device for local token generation, with mobile opportunities expected next year. Edge AI chips and AI PC supply chains enter a new growth cycle.
【Huawei Mate 90 Official: τ-Law Chip Hits 3.1GHz, Rivals 3nm Process】
Huawei CTO Zheng Jun confirmed at the 2026 Phoenix Bay Area Finance Forum: The Kirin chip based on τ-scaling (Tao Law) is already powering the Mate 90 series!
Key specs: • 238 MTr/mm² transistor density (+53.5%) • 41% P-core power efficiency gain • 3.1GHz peak frequency, matching 3nm-class performance
This marks the first commercial deployment of Huawei's "LogicFolding" technology—a major milestone for post-Moore semiconductor innovation. From research paper to mass production in mere months: τ-scaling isn't just theory, it's a battle-tested weapon.
Roadmap to 2031: 400+ MTr/mm², 5.0GHz—and the momentum is just getting started.