Straight from Booth #2056 ECOC Exhibition — Rajan Pai walks through our new 1.6T ZeroFlap optical transceivers. ▶️🚀 The first transceivers to combine our optical DSP and Kfir200 silicon photonics PIC in a single device, they feature advanced telemetry to identify weak optical links and address them before they become network-impacting problems.
Want to go deeper? Catch Rajan live at the show:
🎙️ Wednesday, Sept 23 | 2:40 PM | Market Focus Theatre "Scaling Optical Reliability with Bandwidth Across AI Clusters"
See you there! 👋
#WeConnect #ZeroFlap #OpticalConnectivity #SiliconPhotonics #AIInfrastructure #DataCenter
🚀 We're heading to ECOC Exhibition 2026 — join us in Malaga!
�� Sept 20–24, 2026 📍 FYCMA, Malaga, Spain 🧭 Booth #2056 (Sept 21-23)
Don't miss our technical experts on stage:
🎙️Mohsen Asad
Sept 20 | 4:00 PM | PV-R Multipurpose Room
"Can fast narrow channels keep rising without limit, or will slow and wide become the winner?"
🎙️Rajan Pai
Sept 23 | 2:40 PM | Market Focus Theatre
"Scaling Optical Reliability with Bandwidth Across AI Clusters"
Visit Booth #2056 Sept 21-23 to see these live demos:
⚡1.6T 2xDR4 Fully Retimed Module — powered by Credo Cardinal 802 1.6T DSP and Kfir 200G Silicon Photonics PIC
🔌800G / 1.6T #ZeroFlap Optics
📊Credo PILOT — Real-time link health monitoring and root-cause diagnostics
#ECOC2026 #OpticalConnectivity #SiliconPhotonics #AIInfrastructure
To learn more, visit here: https://t.co/p4CAtYxLO4
The announcement of our 1.6T ZeroFlap Optical Transceivers has drawn a crowd to the Credo booth during the first two days of AI Infra Summit. We had a lot of great conversations about what it takes to keep massive AI fabrics reliable at 1.6T speeds.
If you missed it (or want to see it again), there is one more day of AI Infra left. The 1.6T ZeroFlap Optics will be live and running at Booth #810 all day. Come see the tech that's built to predict failures and accelerate time to first token. Our team will be on hand to walk you through the demo and answer questions.
See you at Booth #810!
#AiInfraSummit #ZeroFlap #OpticalTransceivers #NetwrokReliability #DataCenterNetworking
Introducing 1.6T ZeroFlap Optics.
In this video, Don Barnetson, SVP of Product at Credo, unveils our newest ZF transceivers — the first to combine our optical DSP and Kfir200 silicon photonics PIC in a single device.
Built for AI fabric reliability, these transceivers use advanced telemetry and in-band communication to identify weak optical links and address them before they become network-impacting problems.
Learn more here: https://t.co/NLzIntUuru
Another great show in the books! Thank you to everyone who visited Credo during #CIOE2026 in Shenzhen. Thank you to the CIOE team for hosting a fantastic event.
Over three days, we engaged with customers and partners from across the AI infrastructure ecosystem, showcasing how our latest interconnect solutions are helping scale the networks powering AI.
Booth highlights included a live, system-level demo of our Scale-Out AI Fabric, featuring customer modules built on our Robin and Lark 800G optical DSPs, alongside our 1.6T and 800G optical modules powered by our Cardinal 802 and Robin 802 DSPs, paired with our Kfir and Carmel8 Silicon Photonics PICs.
If you didn't get a chance to connect, reach out — we'd love to continue the conversation https://t.co/T9gwlvxgD7.
#WeConnect #CIOEShenzhen #OpticalDSP #SiliconPhotonics #ScaleOutAI #NetworkInfrastructure
What sets Credo's silicon photonics apart?
In this video, Ronnen Lovinger, our VP of Silicon Photonics, breaks down the key IP behind our technology — from our high-speed modulator, built to perform from 400G all the way to 1.6T and beyond, to our low-loss laser and fiber coupling, which lets us use fewer lasers and less power without sacrificing performance.
If you're in Shenzhen for the last day of CIOE, stop by Booth #13A25 to see it in action.
#WeConnect #SiliconPhotonics #Credo #CIOE2026 #OpticalConnectivity #AIInfrastructure
Credo has joined the Open CPX MSA, a growing consortium of companies collaborating to advance interoperable near-package and co-packaged optical interconnects for next-gen AI infrastructure.
As AI networks scale, bringing optical connectivity closer to the ASIC helps reduce power, signal integrity, and density challenges — and Credo will support the ecosystem with SiPho PICs, optical DSPs, and other components for the standard.
Learn more: https://t.co/JgWhG6eYgJ
#WeConnect
🚀 Milestone: Credo's Toucan Gen6x16 PCIe® Retimer has achieved PCI-SIG® 6.x compliance at 64.0 GT/s and is now listed on the PCI-SIG Integrators List — giving customers standards-based confidence to deploy PCIe 6.0 across AI, HPC, and accelerated compute platforms.
Read the full announcement to see how Credo is delivering the signal integrity, interoperability, and power efficiency needed for the most demanding accelerated computing environments.
https://t.co/za1JG8QLaw
#PCIe #AIInfrastructure #WeConnect
It doesn’t matter how many GPUs are in your data center if your network fabric can’t keep up. @ChrisCollins explains how Credo’s Interoperability Lab validates optical modules powered by Credo DSPs across today’s leading AI networking platforms. The result: lower deployment risk, greater reliability, and faster time to first token.
#WeConnect #Zeroflap
As AI inference scales, the industry needs new ways to connect compute and memory.
Today, we announced our plans to standardize an interconnect within the Open Compute Project Foundation Community. We have established the OCP Open Chiplet Economy (OCE) Lightweight Serial Interconnect (LSI) Workstream and plan to contribute our OmniConnect lightweight AXI framer specification to OCP. The standardization of a lightweight, high-efficiency serial interconnect option promotes the flexible composition of chiplet-based and modular AI systems and reduces reliance on HBM.
“We formed the OCP LSI Workstream to address a clear industry need for innovative interconnect solutions that address the memory wall problem while also enabling a new generation of high-bandwidth and power-optimized modular architectures for AI systems,” said Vishal Shah, Vice President of Product, Credo. “Advancing an open approach to lightweight framing and serial interconnect is critical to enabling flexible chiplet integration, including near-package pluggable configurations, for the next wave of AI inference.”
Learn more: https://t.co/kmAbNwRIz0
#WeConnect
Join us at the Future of Memory and Storage conference this week to see how Credo is helping overcome memory and storage bottlenecks with fast, reliable, and energy-efficient connectivity solutions. Visit booth #1146 to see our OmniConnect Weaver AI memory and chip-to-chip interconnect and Toucan PCIe Gen6 retimers built for AI at scale. Learn more: https://t.co/cvFZ0eN4cW…
#WeConnect
Scale PCIe Gen6 across the rack — without losing the link. At PCIe Gen6 speeds, every connector, trace, and cable matters. Credo extends PCIe beyond the motherboard with AECs, signal conditioning built into the cable, clean Gen6 links up to 7 meters, and makes the entire fabric observable with PILOT, catching degradation before it becomes downtime. How far can your Gen6 links go? https://t.co/WuBI7KST1L
#WeConnect #PCIe #CredoPILOT #telemetry #AIInfrastructure
Excited to be heading to FMS: Future of Memory and Storage 2026 in Santa Clara, August 4–6! Stop by Booth #1146 to discover our connectivity solutions for AI memory and storage. Please reach out to [email protected] to set up a meeting. Look forward to seeing you at the show!
#WeConnect
AI clusters demand more than fast links—they demand reliable ones.
As PCIe Gen6 extends connectivity across the rack, signal integrity and observability become critical to performance. Credo PCIe AECs extend reach to 7 meters. Credo retimers stabilize the channel. PILOT surfaces issues before they impact performance. Because a fast link that fails isn’t fast at all. Learn more: https://t.co/HsdZZ7bi4i
A Gen6 link doesn't fail without warning. It shows symptoms first: intermittent recoveries, equalization churn, margin drift that tracks with temperature, lanes slowly falling out of sync. The problem? Without telemetry, nobody's watching. Credo Toucan PCIe retimers don't just recover the signal; they continuously adapt to keep margin stable across temperature swings, board variations, and workload spikes. PILOT turns the symptoms into signals you can act on. https://t.co/AnukypdHhA
#WeConnect #PCIe #CredoPILOT #telemetry #AIInfrastructure
64 GT/s. Zero room for error. At Gen6 speeds, moving data isn't enough; temperatures shift, workloads spike, channels get harder. Reliable performance takes more than signal recovery. Credo Toucan continuously preserves link margin and reliability. Credo PILOT delivers the visibility to monitor link health, spot bottlenecks, and optimize in real time. https://t.co/AnukypdHhA
#WeConnect #PCIe #AIInfrastructure
Hot take? The next AI bottleneck isn't just bandwidth. It might be finding out at 3am that a link failed, and having no idea why.
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In AI clusters, waiting for a link failure means you've already lost performance, utilization, and potentially training time. The next generation of optical fabrics needs more than bandwidth—it needs observability. Learn how PILOT provides real-time visibility into optical link health, helping operators stop link flaps before they stop workloads: https://t.co/lTveZbd6Fl
#WeConnect #CredoGivesZeroFlaps
At next-generation AI scale, with 10 million+ optical transceivers in a cluster, even rare failure rates can produce a link flap every minute.
The next phase of AI infrastructure requires optical performance and observability to converge. Credo brings real-time intelligence to the optical layer, turning the transceiver from a passive transport device into an active source of operational insight.
Learn more about how ZeroFlap Optics and PILOT provide the visibility to detect, diagnose, and prevent issues before they impact AI workloads: https://t.co/lTveZbd6Fl
#WeConnect #CredoGivesZeroFlap
We Welcome the Credo Summer 2026 US Intern Class!
At Credo, meaningful opportunities build the foundation for future success, and our internship program brings that to life.
This summer, we're welcoming a talented group from diverse backgrounds and career stages to work on real projects powering the AI infrastructure of tomorrow. They'll collaborate with experienced professionals and gain hands-on industry experience while sharpening their technical and professional skills. Our goal is to set the standard for what an early career experience should look like: one rooted in mentorship, growth, and meaningful contribution.
We can't wait to see the impact our interns will make.
#WeConnect