Join this 30-minute BitCast on modern GaN-based AC/DC solutions for USB PD chargers and efficient step-down power architectures.
➡️ Save your seat: https://t.co/nc190jzA3k
#Sponsored by @RenesasGlobal
In this episode of EE Times Current, we’ll dive into Physical AI — from humanoids and embodied agents to the chips, sensors, and systems that let machines see, move, and interact with us.
🎙️ Listen now: https://t.co/AqkiFDdTnO
#Sponsored by @Synopsys
In this podcast, we explore how new sensing technologies and Edge AI are transforming comfort, energy management and privacy in connected living.
🎙️ Listen now: https://t.co/IiJ1cN1Emd
#Sponsored by @Infineon
Product Recall Management Guide for Electronics Manufacturing SMBs
This guide explains what product recalls are, what risks they create, and how small and midsize manufacturers can handle them in an organized way....
#Sponsored
https://t.co/6XQIId81St
Discover sustainable semiconductor breakthroughs to guide your roadmap from lab-to-market and to tomorrow’s AI factory at LID World Summit 2026, in Grenoble, France on June 𝟮𝟯-𝟮𝟱, 𝟮𝟬𝟮𝟲
👉𝗥𝗲𝗴𝗶𝘀𝘁𝗲𝗿: https://t.co/Qx4xWGcF89
AI's Rise Compresses Semiconductor Test Cycle from 3 Years Down to 1. FormFactor CEO Mike Slessor on collaboration, silicon photonics, and the future of AI device testing.
Watch Episode 1 of Mission Central: https://t.co/CmrWhLfaEy
#Sponsored by @FormFactorInc
Join us to explore the fundamental differences between GaN and silicon—and how those differences translate into lower losses, even at high switching frequencies.
➡️ Save Your Seat:
#Sponsored by @arrowglobal and @infineon
In this episode of #silicongrapevine, we explore how AI-driven EDA is accelerating 3D IC design, enabling faster exploration, simulation, and delivery of reliable high-performance systems.
Watch now: https://t.co/lc9Ud0fZWg
Join us for the 2026 #Chiplets event on June 23-24 to learn more about how chiplets are being implemented today and how the industry is overcoming the real engineering challenges of scaling multi-die designs.
Register now: https://t.co/O2SqNBzgom
@Synopsys
Explore TAIYO YUDEN’s metal #powerinductors and #MLCCs for compact, efficient power in next-gen #AI and #GPU applications. #Sponsored https://t.co/ArJNHMQWOx
New Power, Memory, Interconnect, and Thermal Architectures for AI Infrastructure at Scale
Over the last few years, AI data centers have developed novel architectures to achieve the compute performance required to train LLMs....
#Sponsored
https://t.co/E3QTkDTsCO
Discover a new era of #wireless performance with #ULLSCI—unlock ultra-fast speeds and ultra-low latency for next-generation applications. #Sponsored https://t.co/6654vjXYsn
Join this webinar to discover Calibre Vision AI, an AI-driven debug and analysis platform that accelerates full-chip verification, quickly identifies systematic issues, and reduces debug cycle time.
➡️ Save Your Seat: https://t.co/UcAMN8P0c9
#Sponsored by @Siemens