EE Times | Electronic Engineering Times

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[EE Times | Electronic Engineering Times @eetimes]

#Arm's Ami Badani cites the $2 nominal damages #award as validation, while #chipdesign experts point to #openarchitectures such as #RISC_V as the long-term alternative for #AI workload flexibility. #Qualcomm #ArmQualcomm #verdict #customsilicon https://t.co/lxGGPREjVz

[EE Times | Electronic Engineering Times @eetimes]

In this webinar, learn how to add graphics to MCU-based projects, explore hardware options, optimize performance without a graphics accelerator, and understand when external DRAM is needed.
➡️ Save Your Seat: https://t.co/PUisJd4KXQ

#Sponsored by #GigaDevice

[EE Times | Electronic Engineering Times @eetimes]

Electronica 2026 is approaching! Make plans to join the EE Times Forum @ electronica 2026. Join us in person, online, or on-demand.
📍 In person: Semiconductor Innovation Stage, Hall C6-241
💻 Online - Register here: https://t.co/netcLB9FRh

[EE Times | Electronic Engineering Times @eetimes]

The $2 damages award grabbed headlines, but the #Arm-#Qualcomm #verdict’s bigger implication concerns who controls the compliance tests that custom #chips must pass before shipping. #semiconductors #IP #Licensing #customsilicon https://t.co/XxL1NxQTYA

[EE Times | Electronic Engineering Times @eetimes]

Two Dollars and a Test Suite https://t.co/XxL1NxQTYA

[EE Times | Electronic Engineering Times @eetimes]

From Cloud AI to Edge AI: How BIWIN Enables the Next Generation of Storage and Memory Solutions https://t.co/bM0nqGacp6

[EE Times | Electronic Engineering Times @eetimes]

Deepx Building Open Software Ecosystem to Scale Physical AI Beyond the Data Center https://t.co/xuEf9ExAvX

[EE Times | Electronic Engineering Times @eetimes]

In this on-demand webinar, explore 3D IC adoption trends, key design challenges, and how Siemens Innovator3D IC streamlines system-level planning and co-design through an integrated workflow demonstration.
➡️ Register to view: https://t.co/fCg1UcWsFG

#Sponsored by @Siemens

[EE Times | Electronic Engineering Times @eetimes]

How Goodram Validates DRAM and SSD Reliability in Europe https://t.co/yx8QMFcVsS

[EE Times | Electronic Engineering Times @eetimes]

#Everspin targets #AI servers, data centers, and #satellite systems as #NORflash supply constraints open new opportunities for #MRAM. #semiconductors #memoryshortage https://t.co/OIBmM7yNhW

[EE Times | Electronic Engineering Times @eetimes]

Cellular networks, #NTN, and #6G can back up #GNSS against jamming and spoofing, keeping location resilient when GPS fails. https://t.co/otgQgTUdCz

[EE Times | Electronic Engineering Times @eetimes]

#India’s #OSATs must test chips fast enough to hit targets. Here’s how NI Emerson and Kaynes tackle test throughput, legacy migration, and #AI. https://t.co/jye4GNLy3r

[EE Times | Electronic Engineering Times @eetimes]

Why Chip Design AI Benchmarks Must Go Beyond Functional Correctness https://t.co/iZDnF8wRHt

[EE Times | Electronic Engineering Times @eetimes]

In this webinar, learn how power-free multiturn position sensing enables precise motion tracking and advances robotics, humanoids, and industrial automation.
➡️ Save Your Seat: https://t.co/whG8s3Y0zs

#Sponsored by @ArrowGlobal and @ADI_News

[EE Times | Electronic Engineering Times @eetimes]

Edge AI MCU Features Multimodal Compute, Tiered Memory https://t.co/J3pEh4hikQ

[EE Times | Electronic Engineering Times @eetimes]

#Innovasea shrinks fish-tracking tags to 0.3 g, balancing battery life, size, and reliability for acoustic telemetry research. https://t.co/nrQCKC90JU

[EE Times | Electronic Engineering Times @eetimes]

#Singapore moves deep tech from lab to market: A*STAR, #SiC power devices, MetaOptics metalenses, and AMF’s #GlobalFoundries acquisition. https://t.co/PPMBNCVvfb

[EE Times | Electronic Engineering Times @eetimes]

Discover how edge computing and embedded security can combine to deliver fast, privacy-conscious access control.
➡️ Save Your Seat: https://t.co/nQK2wq59gV

#Sponsored by @microchiptech and @ArrowGlobal

[EE Times | Electronic Engineering Times @eetimes]

#Qualcomm’s Chris Lattner says #AI #agents can optimize kernels but can’t replace software engineering or build dependable #chip #software stacks. #softwareengineering #generativeAI #agenticAI https://t.co/ZmuZF3ZbzN

[EE Times | Electronic Engineering Times @eetimes]

Discover how physical #AI unlocks economic value by balancing advanced machine intelligence with strict SWaP-C engineering constraints. https://t.co/ay97bUlwYR