Thank you to everyone who visited GUC at the TSMC CN Symposium 2026. Your valuable discussions continue to inspire our innovations in AI infrastructure, ASIC, HBM4, Chiplet, advanced packaging, and high-speed connectivity.
๐ฏ๐ต Next stop: TSMC Japan Symposium โ July 3. See you!
๐ Happy Dragon Boat Festival from GUC! ๐ฃ
Teamwork and perseverance drive both the Dragon Boat Festival and innovation.
Together with our customers and partners, GUC continues advancing next-generation AI infrastructure.
Wishing you health, happiness, and prosperity. ๐
Excited to see the official launch of the Co-Packaged Optics (CPO) ecosystem collaboration announcement with Wiwynn and industry partners.
Learn more ๐๐ปEnglish: https://t.co/ltKdUnsVSX
ไธญๆ: https://t.co/igMQdtGXf1
#GUC#Wiwynn#CPO#AIInfrastructure
ใGUC x Wiwynnใ
Wiwynn Advances Datacenter Design at Computex 2026 with High-Power and Optical Interconnect Solutions
For detailed press release information, please refer to the following link:
(English) https://t.co/W1PBV8iez5
(Chinese) https://t.co/jfSFyfqHHE
๐ฐใPress Releaseใ๐ฐ
GUC is proud to showcase VSORA's next-generation AI inference processor, Jotunn8, at the upcoming TSMC Europe Technology Symposium on May 28 in Amsterdam. ๐ท
Explore the full press release on our website: https://t.co/9kHxxfNF6D
๐GUC is excited to welcome you to #Booth24 in Hsinchu.
Visit us to explore our live physical demo boards, discuss future collaboration opportunities with our business and technical teams, and connect with GUC leadership onsite!!!
๐ Booth #24
๐ May 14, 2026 | Hsinchu, Taiwan
GUC is now on-site at SNUG Silicon Valley, and our team is ready at the booth for two days of technical exchange and industry networking.
Come meet our team, exchange ideas, and explore how we can help bring your next chip to production. ๐ซ
Embedded World 2026 โ GUC is ready ๐๐ป
Our team is on-site at #EmbeddedWorld2026, and the booth is ready.
Stop by to meet the team and discuss how we can accelerate your next silicon innovation.
๐ Booth: 3A-417
๐ March 11โ13, 2026 | Nuremberg, Germany
๐ฃใGUC's first exhibition in North America next Wednesday and Thursday โ SNUG SV 2026 ใ๐ฃ
We look forward to welcoming you at our booth at SNUG. Please join us on-site and connect with our team to explore our latest ASIC design innovations and silicon implementation expertise.
โณ๏ธ Milestone Achieved: UCIeโข 64G on TSMC N3P โณ๏ธ
GUC has completed tape-out of its UCIeโข 64G IP on TSMC N3P, delivering 64 Gbps per lane and 21 Tbps/mm bandwidth density to power scalable chiplet architectures for AI & HPC. Learn more: https://t.co/SbeItmUnT8
๐ Dual Events in March โ GUC at Embedded World & SNUG SV ๐
๐ Embedded World 2026 (Mar 10โ12, Nuremberg)
๐ SNUG Silicon Valley (Mar 11โ12, Santa Clara)
Connect with us at either event.
๐ https://t.co/4SNiHDiAqL
Thank you to our customers, partners, and teams for your continued trust and collaboration.
May the Year of the Horse bring speed, strength, and shared success.
Letโs accelerate innovation together.
๐ Meet GUC at #ChipletSummit2026
Presenting at OCP Tutorial: Multi-Chiplet System Integration Solution
End-to-end ASIC + advanced packaging + system integration
๐ Santa Clara ๐ค
#Chiplet#ASIC#Semiconductor
Lightmatter ร Global Unichip Corp.
Strategic partnership to commercialize Passageโข 3D CPO, redefining AI interconnect at hyperscale.
Combining silicon photonics with advanced ASIC, chiplet & packaging to break I/O limits.
๐ Full PR: https://t.co/fapGkqodqV
As we step into 2026, GUC extends our warmest New Year wishes to our customers, partners, and collaborators worldwide.
Wishing you a successful and inspiring 2026.
Happy New Year ๐
GUC extends its sincere congratulations to ASPEED Technology on the official launch of its Kaohsiung R&D Center, marking an important milestone in strengthening Taiwanโs northโsouth dual-engine innovation framework.
Congratulations to ASPEED on this exciting achievement. ๐
๐ GUC is now exhibiting at TSMC China OIP in Nanjing! ๐
Our team is onsite and excited to meet youโcome visit the GUC booth and letโs discuss how our cutting-edge ASIC, 2.5D/3D, and high-performance IP solutions can power your future innovations. ๐ค๐ค
Only Three Days to Go!
TSMC China OIP is just around the corner, taking place this year in Nanjingโthe final OIP event of 2025.
We warmly invite you to visit GUC #Booth25. See you in Nanjing! ๐๐ป
#GUC#TSMCOIP#China#Booth25
We thank our customers, partners, and friends worldwide for your trust. Your collaboration drives GUC to push boundaries in advanced ASIC design, 2.5D/3D integration, and high-performance IP. Grateful to walk this journey with youโwishing you a warm and meaningful Thanksgiving.