Hybrid bonding is an advanced semiconductor packaging technology that stacks chips face-to-face. Unlike traditional methods that use solder microbumps, it creates direct copper-to-copper connections fused with a dielectric material. This eliminates bulky connections, significantly increasing interconnect density, lowering power consumption, and boosting bandwidth
Top players $ADEA $BESI , SUSS, EV Group
@StocksOnSpaces@stocktalkweekly is true, I walked into a small 200m company in optics for head gear with 15k worth of stock
I was so excited and they were too!
Rocket Lab 🤝 Mars
From orbiters and landers to rovers and helicopters – our technology has enabled some of the most ambitious Mars missions in history.
With Motiv (creators of Perseverance's robotic arm) now part of Rocket Lab, we're one of the few companies capable of delivering complete Mars mission solutions, including launch + spacecraft + software, and now proven robotics for surface and orbital operations too.
$RKLB 🌏
⚡ Hardware meets reality.
Rocket Lab is physically mating the Archimedes engine to Neutron. This isn't design verification, this is a manufacturing milestone before a fully stacked vehicle takes the pad to challenge Falcon 9, fill the wide gap left by BO. 🚀✨️