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https://t.co/KZiQCzLMd8
【Press Release】Sumitomo Bakelite Co., Ltd. announced that it will expand production capacity for semiconductor encapsulation materials at its group company, Sumitomo Bakelite (Suzhou) Co., Ltd., by adding new production lines to address growing semiconductor demand driven by the rapid proliferation of generative AI. The expansion will increase production capacity by approximately 30%, strengthening a stable global supply system and supporting rising demand in next-generation semiconductor fields, including AI data centers.
Details👉
https://t.co/oQ7M1gKAmq
【Press Release】Sumitomo Bakelite Co., Ltd. has developed a prepreg and laminated board using diallyl phthalate (DAP) resin, featuring excellent tracking resistance (900V) and insulation performance.
In addition to high tracking resistance, the product offers high dielectric breakdown strength, reliable insulation, high mechanical strength through glass cloth reinforcement, and heat resistance derived from thermosetting resin.
These characteristics make it suitable for high-voltage applications such as xEVs, industrial power supply equipment, and electronic devices, contributing to insulation components and structural materials. [https://t.co/YEQTaWmNhK]
Read more👇
https://t.co/lkUqilsA05
【Press Release】Development of High-Tg Epoxy Molding Compounds for Next-Generation SiC Power Modules
Sumitomo Bakelite Co., Ltd. has developed and started mass production of the “G785 Series,” encapsulation materials for next-generation SiC power modules, achieving an industry-first* glass transition temperature (Tg) of 230°C in solid epoxy resins—one of the highest levels in the world.
This development aims to provide material solutions that support the advancement of next-generation power electronics while contributing to the realization of an energy-efficient society.
▼For more details
https://t.co/APSyiLAFY6
【Press Release】
Sumitomo Bakelite Co., Ltd. has developed and initiated the trial launch of the EME-L series, a liquid encapsulant offering low warpage and high reliability, designed to address the increasing size and complexity of semiconductor packages driven by advances in AI technology.
With the rapid adoption of generative AI, semiconductors are required to deliver higher performance, faster processing speeds, and greater capacity, accelerating the adoption of 2.xD/3D and chiplet architectures.
This development aims to meet these evolving demands while maintaining cost efficiency and enabling the continued scaling of advanced semiconductor packages.
👉Learn more
https://t.co/ZNQEQrXj68
【Press Release】
Sumitomo Bakelite Co., Ltd. will participate in the IEEE 76th Electronic Components and Technology Conference (ECTC 2026), one of the world’s largest international conferences on next-generation semiconductor packaging and assembly technologies.
The conference will be held from May 26 to 29, 2026, in Orlando, Florida, USA, and will cover advanced technologies, including those supporting the evolution of AI semiconductors.
At ECTC 2026, we will present three technical papers, jointly with universities and research partner companies.
👉 More details:
https://t.co/E49vVuruxB
[Press Release]
Sumitomo Bakelite Co., Ltd. has decided to expand production facilities for steerable microcatheters at Akita Sumitomo Bakelite Co., Ltd. in response to the continued growth in demand for these products used in endovascular treatment.
Through this initiative, we will ensure a stable supply that meets the increasing needs of medical institutions, while contributing to advances in the sophistication and minimally invasive nature of endovascular treatments.
▶ Learn more
https://t.co/8k1PFKeruh
【PressRelease】
Sumitomo Bakelite Co., Ltd. has developed a high‑voltage insulating sheet with an industry‑leading thickness of 0.2 mm.
The sheet provides reliable electrical insulation under high‑voltage conditions and contributes to the miniaturization and higher density of electrical components in electrified applications.
▼For more details
https://t.co/Bp7mSmusHc
【Press Release】
Sumitomo Bakelite Co., Ltd. has developed a high tracking resistance epoxy resin powder coating with a CTI of 900V.
This material is a solvent-free epoxy resin–based electrical insulation powder coating, suitable for insulation coating of conductors such as busbars exposed to high voltage.
As high-voltage systems such as 800V EV electrical systems continue to expand, this product contributes to the miniaturization, higher efficiency, and improved reliability of electrical systems and components.
▼For more details
https://t.co/VnD0Vu8Fzf