We've begun the equipment manufacturing and procurement process for our fab partners in Ireland and Germany. Updates on each stage of the process will be communicated and documented in this thread as they become available.
I will reveal our hardware setup at our hardware setup at TSMC Taiwan at some point on this X account. It'll be novel. Potentially an intro with a TSMC exec. We can't take picture inside the chip fab but the technical showcase will not be short of unreals.
TSMC will directly involve in paving ways for our hardware acquisition as well as supporting us integrating our equipment into their chip fabs around the world.
On May 7, Calorion signed a mutual agreement to implement our newly designed cooling system at their chip fabrication facility in Taiwan which is marking just the beginning of what we expect to be a strong partnership.
We deliver cutting-edge chip-level cooling solutions designed for AI training data centers worldwide, enabling superior thermal performance, efficiency, and scalability.
AI training is scaling fast, but so is energy waste.
Too much power is lost as unmanaged heat instead of useful compute.
SemiconductorAC turns thermal control into software: predict heat early, adapt in real time, and cut wasted energy at the silicon + system level.
It uses real-time sensing, predictive thermal intelligence, and adaptive orchestration to detect heat risk early and coordinate cooling responses across silicon, packaging, and system environments.