Top Tweets for #icsubstrates
How will direct metallization deliver #sustainability gains across the #supplychain? We’re eager to hear from Leslie Kim, @MacDermidAlpha, when he presents at the IPC High Reliability Forum. #ICsubstrates #DM #PCB #fabrication #sustainability https://t.co/MQqkEkeyms
Why #HDI and Ultra #HDI? Join IPC Hall of Famer Mike Carano for a webinar “#HDI/Ultra HDI: #ICSubstrates and #AdvancedPackaging, on March 29. #BuildElectronicsBetter https://t.co/JYuNMviBMr
Why #HDI and Ultra #HDI? Join IPC Hall of Famer Mike Carano for a webinar “#HDI/Ultra HDI: #ICSubstrates and #AdvancedPackaging, on March 29. #BuildElectronicsBetter https://t.co/ChLYqCUqor
Success of CHIPS Act depends on quickly establishing a pilot facility for integrated circuit substrates according to a new industry report from IPC’s Chief Technologist Council. Read report: https://t.co/EYkLvBlSlr #ChipsAct #ICSubstrates #ChipsforAmerica #IntegratedCircuits
Discover our advanced interconnect metallization processes at the @IMAPSorg Device Packaging Conference & Expo. Visit our booth 31-32 to learn more about our extensive leadframe product portfolio. https://t.co/l9SGoO3MTH #advancedmetallization #devicepackaging #icsubstrates
This announcement is a sign that IPC’s message is getting through: that any nation or bloc hoping to rebuild its domestic #microelectronics industry needs to take a broader, “silicon-to-systems” approach that includes #printedcircuitboards, #ICsubstrates, and #advancedpackaging.
The CHIPS and Science Act is a historic opportunity to solidify America’s global leadership and ensure our long-term national security.
We’re committed to getting it right.
New Single Step Copper Through-Hole Filling Process to Improve IC Substrate Designs
Read More: https://t.co/R9ZIpktGk6
@MacDermidAlpha #throughholefilling #metallization #copperthroughhole #copper #substrates #ICsubstrates #PCBlayers #electroplating #copperelectroplating
#digitalisierung Der Leiterplattenhersteller AT&S steigt in die innovative #icsubstrates Produktion ein. https://t.co/MK0hPtPCRR @ATS_IR_PR
#digitalisierung eröffnung der #ats #icsubstrates werkes in chongqing. Erstes substratewerk in china.
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