Top Tweets for #iotdevcon
Top 10 #IoT and #EdgeComputing conferences to attend in 2019 via @Enterprisenxt https://t.co/wMUTJioknF #iotdevcon #IoTWorldSeries #IoTEvolution #IoTClan and more @TopCyberNews @TechNative @MHiesboeck @mclynd @iotforall @antgrasso @joao_b @jblefevre60 @Paula_Piccard

Top 10 #IoT and #EdgeComputing conferences to attend in 2019 via @Enterprisenxt https://t.co/wMUTJiFVMf #iotdevcon #IoTWorldSeries #IoTEvolution #IoTClan and more @TheIoTWarehouse @Chels_LA @CRudinschi @ipfconline1 @fogoros @Ronald_vanLoon @IIoT_World

Our CTO @EdKuzemchak speaks at @iotdevcon on how to leverage fog-based machine learning.
Can't make the event? You can get Ed's speaking notes and slides. Find out how: https://t.co/T8mJusqkSZ
#IoTdevcon #tech #IoT #DevOps #API #IoTDevCon2018 #ML @FrankZ_AVI

#AI trajectory predictions from Ray Kurzweil via @GFfab8 #IoTDevCon via @bluevalhalla #artificialintelligence

.@tiriasresearch predicts significant changes in #machinelearning/ #AI to come with local learning and collective intelligence. #IoTDevCon #MLDevCon #IoT

Arm projects phenominal growth in #IoT, especially with Arm-based chips. #IoTDevCon #MLDevCon via @TekStrategist @arm @ArmEmbedded @Qualcomm_Tech

6 laws for #machinelearning from @BessemerVP #iotdevcon @rcrwirelessnews via @susanm_rambo #ai #ArtificialIntelligence

Had a blast giving the keynote at #IoTDevCon 2018! Discussing our laws for #ML and #AI investing @BessemerVP


3D packaging is the future to increase memory density and performance. @GLOBALFOUNDRIES #IoTDevCon #MLDevCon

2.5D packaging solution are being used to increase logic and memory configurations. @Globalfoundries #IoTDevCon #MLDevCon

@Globalfoundries provides a projection for AI that is both encouraging and scary. #IoTDevCon #MLDevCon

Great presentations from @NXP on edge computing and @bessemerventure on the future of IoT at #IoTDevCon #MLDevCon



Enabling edge computing will allow vast amounts of unused data to be processed according to @NXP, the leader in IoT solutions. #IoTDevCon


Edge ML/AI solutions are taking multiple forms, but there are trade offs with each depending on power, form factor, and the workloads. There is no one-size-fits all for intelligent devices. @tiriasresearch #IoTDevCon #MLDevCon

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