@Zeptobars I usually stop using the laser when the bond wires become visible and use acid from there. In general, wet etching is much faster when the package top surface has been removed using a laser.
@Zeptobars One problem using lasers is that stacked spheres can act like a magnifying glass, burning the die even tough there still should be enough material above the die. I need the dies still in a working condition, but lasers haven’t worked a singe time for me either.
@sad_electronics I‘ve seen this on here before. Don‘t remember who posted this, but I just saved this image a reference for future projects. Seems to be working fine tough.
@gsuberland Where I come from this color too is called Resedagreen (RAL 6011) and even mentioned in a national standard (DIN 1844) for machine coloring bc its beneficial effects. I once heared it should cause less eye strain under bad lighting bc it coincides with the eye sensitivity maximum
Tested a dumpster scope I repaired a few days ago. The Sad thing is, that the only thing broken was the soldered CR2354. Lucky they didn’t use NVRAM with this anymore. Now the green CRT gives a cozy feeling.
Switched from Pynq-Z1 to AVNET Picozed for FPGA prototyping with better connectivity. The new board is quite impressive, but since the 7030 SoM HP I/Os are only 1.8V I’m even more afraid to break it with accidental overvoltage or ESD. Can‘t wait to run my first designs.
Auch wir müssen uns den aktuellen Umständen anpassen und präsentieren Euch den neuen Termin für #DoKomi2020:
> 12. - 13. September 2020 !!
Heute um 21:00 Uhr werden wir Euch auf #DoKomiTV alle Informationen und Details
FAQ: https://t.co/S5gz7ZtEm7
Euer DoKomi Orga-Team
Am #Animexx Adventskalender wird heute das zweite Türchen geöffnet. Es gilt 15 Anime-Openings zu erraten. Sponsoren heute: Die @Sammlerecke , @Shinjischneider und @Shirokuchan , die uns einige CDs zur Verfügung gestellt hat 😁 https://t.co/T2PA0WJgoK