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The #Huawei#ICTCompetition 2025–2026 Global Final has concluded with the Global Final Closing & Awards Ceremony. After the Practice, Innovation, and Programming Competitions, 18 outstanding teams from eight countries were awarded Grand Prizes:
–Innovation Competition Grand Prize: Wuhan University of Technology, Ahmadu Bello University, National University of Singapore, and Fujian Normal University
–Programming Competition Grand Prize: Wuhan Vocational College of Software and Engineering
–Practice Competition – Network Track Grand Prize: Algerian team, Brazilian team, Nigerian team, and Shenzhen Polytechnic University
–Practice Competition – Cloud Track Grand Prize: Egyptian team, Algerian team, Central South University of Forestry and Technology, and Kenyan team
–Practice Competition – Computing Track Grand Prize: Egyptian team, Henan Institute of Economics and Trade, Dominican Republic team, and Algerian team
–Practice Competition – Ascend AI Track Grand Prize: Shenzhen Polytechnic University
Explore more from the Huawei ICT Competition 2025–2026 Global Final in Shenzhen: https://t.co/0WNJ9OXJX7 #ICTheFuture
Tune in now! The Huawei ICT Competition 2025–2026 Global Final Closing & Awards Ceremony is streaming live. Join to experience the best moments, and watch top ICT talent take center stage. https://t.co/U0OOb0S1RO
The AI Accelerating Education Transformation Summit is now live. Join the livestream to explore AI-driven education, insights, and real-world innovation. See what's shaping the future of learning at the Huawei ICT Competition 2025–2026 Global Final. https://t.co/poWIcmqxGf
Guizhou now ranks among China's leaders in base stations and 5G coverage, with nearly 200,000 sites and full 5G access across villages and high-speed rail lines. Huawei and China Mobile are expanding 4G, 5G, and 5G-A networks to connect mountainous regions and drive rural growth.
Day 2 has begun in Shenzhen at the Huawei ICT Competition 2025–2026 Global Final. Participants are competing in the Programming Competition and Innovation Competition Challenges, where their AI and ICT knowledge and problem-solving skills will be tested.
At the Huawei ICT Competition, student teams from around the world are exploring how AI can solve real-world challenges across accessibility, education, language learning and smart logistics, showing how young ICT talent is shaping a smarter and more inclusive futureAt the Huawei ICT Competition, student teams from around the world are exploring how AI can solve real-world challenges across accessibility, education, language learning and smart logistics, showing how young ICT talent is shaping a smarter and more inclusive futureAt the Huawei ICT Competition, student teams from around the world are exploring how AI can solve real-world challenges across accessibility, education, language learning and smart logistics, showing how young ICT talent is shaping a smarter and more inclusive futureAt the Huawei ICT Competition, student teams from around the world are exploring how AI can solve real-world challenges across accessibility, education, language learning and smart logistics, showing how young ICT talent is shaping a smarter and more inclusive future.
Live in Shenzhen, the Huawei ICT Competition 2025–2026 Global Final is in full swing. Students and teachers have joined from around the world and are building ICT knowledge, sharpening technical skills, and driving innovation together on the global stage.
The Huawei ICT Competition 2025–2026 Global Final is now underway in Shenzhen. The global platform brings together students and teachers from around the world to build ICT knowledge and skills, and drive innovation through global exchange. The event runs June 2–5.
The Huawei ICT Competition 2025–2026 Global Final is bringing the world's talented and aspiring tech students to Shenzhen. Tune in June 5 for the AI Accelerating Education Transformation Summit, 9:30–12:00 (UTC +8), and the Closing & Awards Ceremony 15:00–18:00The Huawei ICT Competition 2025–2026 Global Final is bringing the world's talented and aspiring tech students to Shenzhen. Tune in June 5 for the AI Accelerating Education Transformation Summit, 9:30–12:00 (UTC +8), and the Closing & Awards Ceremony 15:00–18:00The Huawei ICT Competition 2025–2026 Global Final is bringing the world's talented and aspiring tech students to Shenzhen. Tune in June 5 for the AI Accelerating Education Transformation Summit, 9:30–12:00 (UTC +8), and the Closing & Awards Ceremony 15:00–18:00The Huawei ICT Competition 2025–2026 Global Final is bringing the world's talented and aspiring tech students to Shenzhen. Tune in June 5 for the AI Accelerating Education Transformation Summit, 9:30–12:00 (UTC +8), and the Closing & Awards Ceremony 15:00–18:00.
Student stories are coming! From June 2 onwards, we'll be sharing student highlights from the Huawei ICT Competition Online Popularity Award. Stay tuned, discover their journeys, and support the stories you like through likes, comments, saves, and shares!
What is LogicFolding? For circuit design, it aggressively compresses propagation time between adjacent flip-flops, tightens critical path & enables chips to run faster. HUAWEI high-end chips are expected to feature transistor density equivalent to 14 Å (1.4 nm) processes by 2031.
In the past six years, Huawei has successfully designed and mass-produced (??) chips based on the Tau (τ) Scaling Law, meeting the needs of various industries.
According to Tau (τ) Scaling Law, the transistor density of high-end chips is expected to reach the same level as that of chips using the (??) nm process by 2031?
Huawei has innovatively proposed core technologies such as LogicFolding to build a multi-level collaborative optimization system. Which of the following levels are included in this system?
Along the path toward HUAWEI's new Tau (τ) Scaling Law breakthrough, the company designed and mass-produced 381 chips for various industries, and it now foresees continued collaboration on the road to shared success in the semiconductor sector.
Owing to HUAWEI's Tau (τ) Scaling Law breakthrough, the implementation of time scaling will use technologies such as LogicFolding to continuously reduce signal propagation delay and improve transistor density.
Based on HUAWEI's Tau (τ) Scaling Law, innovative LogicFolding technologies will be first implemented in the upcoming HUAWEI Kirin 2026, and subsequently help high-end HUAWEI chips achieve a groundbreaking transistor density equivalent to 14 Å (1.4 nm) processes by 2031.
It's been a long journey — 6 years and 381 chips to be exact — but HUAWEI's He Tingbo explains how HUAWEI's high-end chips are now expected to feature a transistor density that is equivalent to 14 Å (1.4 nm) processes by 2031.