Jan Vardaman

[Jan Vardaman @Jan_TechSearch]

The latest issue of ChipScale Review features details of AMD's Heterogeneous Integration packages including 3D V-Cache and Elevated Fanout Bridge (EFB)! Lots of details on https://t.co/GFhICj1xAT

[Jan Vardaman @Jan_TechSearch]

Attending the 3D&Systems Summit in Dresden where hybrid bonding is the main topic of discussion. Many organizations are working to solve issues that will allow increased adoption of the process.

[Jan Vardaman @Jan_TechSearch]

Attending ECTC where we have more than 1,000 attendees! 3D IC hybrid bonding sessions are packed, showing us it is a hot topic this year!

[Jan Vardaman @Jan_TechSearch]

Joint me on February 2022 Semiconductor Industry Speaker Series Webinar
Wednesday, February 2, 2022
11:30 AM in Pacific Time (US & Canada)

Semiconductor Packaging and Assembly Trends: Outlook for 2022

Register for Free: https://t.co/jlTL5wKLrr

[Jan Vardaman @Jan_TechSearch]

Great discussion today on thermal issues for 3D at DOE workshop. Tomorrow's discussion is expected to provide insight on metrology for 3D and I/O and Interconnects for 3D!

[Jan Vardaman @Jan_TechSearch]

Lots of emphasis on 3D IC with hybrid bonding at today's Taiwan ISES.

[Jan Vardaman @Jan_TechSearch]

Attending the Taiwan ISES virtually, TSMC has no plan to put assembly in the AZ fab.

[Jan Vardaman @Jan_TechSearch]

Today's Samsung Foundry Forum included a discussion on future advanced semiconductor node package options, including WLP, 2.5D (silicon interposer), and 3D with µbump or hybrid bonding.

[Jan Vardaman @Jan_TechSearch]

Supply of high-performance substrates will continue to be a problem, despite recent capacity additions and plans. https://t.co/f0jaF7rwix

[Jan Vardaman @Jan_TechSearch]

We are celebrating 34 years in business! Thanks to all our friends and clients for your support all these many years!

[Jan Vardaman @Jan_TechSearch]

Listening to the HIR today. Join me tomorrow at the virtual SiP for the live panel discussion on SiP Challenges for 5G with panel members from Amkor, ASE, Cadence, JCET, and Fraunhofer. Check it out on https://t.co/maS8wqRps7

[Jan Vardaman @Jan_TechSearch]

Just concluded the live ECTC Plenary session: Transformation of the Electronics Industry in a Post-Covid World..if you missed it catch the recording. Register at https://t.co/HnKl23Q7M5! Don't miss great papers and special sessions. Join the live thermal issuespanel on June 8

[Jan Vardaman @Jan_TechSearch]

During the ISES Advanced Packaging Seminar, Intel just indicated they will offer assembly services for non-Intel silicon with the new IDM2.0 Foundry Service!

[Jan Vardaman @Jan_TechSearch]

Celebrating Earth Day today! How did you celebrate the day? Hope we can all make a difference!

[Jan Vardaman @Jan_TechSearch]

After Bryan Black of AMD's talk today at the IMAPS Device Packaging Conference GBC, one can easily see why everything is coming up chiplets at the most advanced semiconductor nodes....

[Jan Vardaman @Jan_TechSearch]

IMAPS DPC virtual opened today with 2 great keynotes from Samsung and Intel. We had a great panel discussion on Electronics Industry Supply Chain: Is it Broken? Join tomorrow for more!

[CEA-Leti @CEA_Leti]

[PRESS] @CEA_Leti CEO @SabonnadiereE shares insights with @Jan_TechSearch about the future of R&D “𝘛𝘩𝘦 𝘙𝘰𝘰𝘵𝘴 𝘰𝘧 𝘔𝘢𝘯𝘶𝘧𝘢𝘤𝘵𝘶𝘳𝘪𝘯𝘨” in this month’s Circuits Assembly Magazine.🗞️
https://t.co/umFKQ5KPXV
#RnD #RTOs #research #electronic #semiconductor

[Jan Vardaman @Jan_TechSearch]

Samsung's Forum today highlights the importance of partnerships! Great keynotes, panel discussion, and networking options.

[Jan Vardaman @Jan_TechSearch]

IMAPS is off to a great start with keynotes from Intel and AMD! Plenty of work to do in packaging for the future!

[Jan Vardaman @Jan_TechSearch]

Great presentations at the MEPTEC KGD workshop this morning from NVIDIA and Cisco! So much progress has been made in this area! Two more mornings of presentations to come!