@GPUsAreMagic@TMobile_CZE ...for smartwatch and the like.
Well if I accept this free extra, that alone can give O2 the right to force me into a worse tariff.
@GPUsAreMagic@TMobile_CZE ...until they give you an acceptable offer.
And if you do get into the grandaftering situation, keep in mind it has negatives.
I cannot get any additional O2 mobile service, or my current contract gets "unlocked".
For example, O2 offers free extra data SIM card 2/3
We KILL #PS6 RAM Hysteria, debunk #AMD X970E rumors, and discuss the potential for #XSX FSR4 & PS5 PSSR Lite on Broken Silicon 362!🔥
We also talk #Nintendo Switch 2 price increases, Half Life 3, and @asha_shar dodging Steam on #XBOX Helix questions...
https://t.co/ObEhhutbvL
@lithos_graphein TSMC cannot realistically do much more do increase wspm. The implication they are intentionally limiting supply is incorrect and frankly irresponsible.
Tonight I leak Xbox "Project Green Leaf" a new initiative that aims to bring longer battery lives to #Xbox Handhelds, and greater efficiency to...PS5?!🤯
I also analyze today's Game Dev Spring '26 update, and celebrate MS axing Copilot AI on consoles!🥳
https://t.co/NkOiwu0lbq
@lithos_graphein Exactly. My point being that packaging is a dogfight between many leading edge suppliers. Very different from other areas of semiconductor industry, which have been whittled down to a massive leader and, at best, an overachieving underdog maintaining some sense of competition.
@lithos_graphein EMIB with TSV. Intel fans saw it as proof of Intel’s supposed packaging advantage.
But, in advanced packaging, competition is extremely fierce and fast.
On Broken Silicon 360 we discuss:
1) #AMD's Zen 7 AM5 Ticking Timebomb💣
2) RTX 5070 12GB #Shrinkflation 💸
3) #PS6's New Performance Baseline for PC Gamers🤯
4) Valve's NEW Steam Controller!♨️🎮
5) #Nvidia N1X🤔
6) Tim Cook Stepping Down as CEO🍎
https://t.co/tRkecpUGSw
@lithos_graphein The technologies for wafer construction are wildly different. This is to be expected. Silicon is easy, try building a fussy mineral layer by atomic layer, being forced to handle differences in lattice stress between those layers and the substrate you are forced to use.
@iamsheady That one is. AMD does have the right to use it for themselves, so they could make an APU from it.
But this article, and Kepler's post, are only about the GPU bot having any console modifications.
Can't help but remember another leaker who leaked the entire chip last summer - including the fact the GPU will use the same die used in RDNA5 dGPU products.