There's 1 more bottleneck more massive then $MU $SNDK $WDC $STX $DRAM for memory.
It's in $AI networking and advanced packaging, only a few experts are discussing this right now.
Remember In 1 year...
$ARM $100 → $440 — licenses chip architecture powering nearly every AI mobile and edge device
$AVGO $145 → $420 — custom AI silicon for hyperscalers plus networking chips tying clusters together
$AMD $80 → $540 — MI-series GPUs becoming the real second source to $NVDA compute
$AEHR $7 → $115 — burn-in test equipment demand scales directly with AI chip production volume
$AAOI $8 → $190 — optical transceivers move data between GPUs as cluster bandwidth needs explode
This one is next $AMKR for advanced packaging and read my notes...
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