Piero Triverio

Professor at University of Toronto. Canada Research Chair in Computational Electromagnetics.

[ECE U of T @eceuoft]

🏆 Congrats to ECE MASc student Atacan Tuhan on winning the Best Student Paper Award at the 30th IEEE Workshop on Signal and Power Integrity!

His paper was co-authored with Damian Marek, Yongzhong Li, and ECE Prof. Triverio, in collab with AMD Canada.

[Piero Triverio @modelics]

@eceuoft Congratulations Atacan and thanks @AMD @NSERC_CRSNG @Alliance_Can @CMCMicrosystems!

[Piero Triverio @modelics]

@Tebasjavier Sin verguenza no parar a frente de mas de 200 muertos. Sin verguenza!

[Piero Triverio @modelics]

EPEPS' deadline is 1 month away!

𝐒𝐮𝐛𝐦𝐢𝐭 𝐚 𝐩𝐚𝐩𝐞𝐫
https://t.co/GToRARmksY
Apply for 𝐬𝐭𝐮𝐝𝐞𝐧𝐭 & 𝐲𝐨𝐮𝐧𝐠 𝐩𝐫𝐨𝐟𝐞𝐬𝐬𝐢𝐨𝐧𝐚𝐥 𝐠𝐫𝐚𝐧𝐭
https://t.co/2gOvv9fUQU
𝐂𝐨𝐦𝐩𝐚𝐧𝐢𝐞𝐬 sponsorship are in high demand
https://t.co/uj8yfluTlM

@IEEEorg @IEEEMTT

[Piero Triverio @modelics]

Graduate student and young professional grants are available to help junior scientists attend EPEPS 2024! Apply by June 14th:
https://t.co/zgK1IdQRyn

And consider submitting a paper!
https://t.co/y3JoCjv6K4

Thanks to funding from @IEEEMTT @ieee EPS IEEE MTT TC-16

[Piero Triverio @modelics]

We just released the sponsor/exhibitor packages for EPEPS 2024! Promote your latest products and recruit top talent at the premier international conference on electrical performance of interconnects, packages, systems

https://t.co/m45PlA9lyY

@IEEEorg @IEEEMTT EPS @ieeeaps

[ECE U of T @eceuoft]

Good news! ECE PhD candidates Yongzhong Li and Qinghao Zhang are finalists for the $75,000 Qualcomm Innovation Fellowship for North America. They’re in the running for developing new electromagnetic simulation technologies. Congrats! https://t.co/cNZPJ4wq3O #UofTEngineering #UofT

[Piero Triverio @modelics]

EPEPS2024 will be in Toronto, October 6-9 2024! Submit your latest findings by *June 14* to the premier international conference on the electrical modeling, analysis, and design of interconnections, packages, and systems!
https://t.co/gSKJYJnoaE
@ieee EPS @IEEEMTT @ieeeaps

[Piero Triverio @modelics]

Great co-op opportunity at @AMD to work at the forefront of high-performance integrated circuits! For undergrad students (2nd ,3rd, 4th year). @eceuoft @uoftengineering @UofT

https://t.co/DWHqZjmXxX

[Piero Triverio @modelics]

Congratulations Yongzhong Li for receiving a Fellowship by the IEEE Antennas&Propagation Society! Yongzhong works on fast algorithms for the EM modeling of ICs, antennas, metamaterials, in collaboration with @AMD !

Thanks @ieeeaps!
@eceuoft @uoftengineering @UofT
@NSERC_CRSNG

[Piero Triverio @modelics]

EPEPS 2023: 3rd keynote speaker will be Dr. Lester Lampert, quantum computing research scientist with Intel. Looking forward to hear about the prospects and challenges in quantum computing, including on interconnects!

Still time to send a paper!
https://t.co/SrtHtL2iDd

[Piero Triverio @modelics]

EPEPS 2023 update: keynote speech by Dr. Al Ruehli, father of PEEC & MNA! Best way to celebrate the 50th anniversary of the PEEC method!

Don't miss this year EPEPS. Still time to submit your paper and register: https://t.co/SrtHtL2QsL

@ieee EPS @IEEEMTT @ieeeaps

[Piero Triverio @modelics]

Delighted to announce one of EPEPS2023 keynote speakers: Prof. José A. Cobos, a leading expert in power electronics! Register and submit your contributions to:

https://t.co/SrtHtL2iDd

#signalintegrity #powerintegrity #packaging
@IEEE
EPS @IEEEMTT
@ieeeaps

[Piero Triverio @modelics]

The EPEPS2023 deadline has been extended to July 31st! We look forward to receiving your submissions and seeing you in Milpitas this October!

https://t.co/SrtHtL2iDd

#signalintegrity #powerintegrity #packaging
@IEEE EPS @IEEEMTT @ieeeaps

[Piero Triverio @modelics]

Just published: @elisafevola shows a new approach to generate boundary conditions for cardiovascular simulations using vector fitting. With T. Bradde S. Grivet-Talocia @bme_uoft @eceuoft @uoftengineering @UofT @PoliTOnews

https://t.co/Qgi0gwYsEG
Code:
https://t.co/9PqV0riItH

[Piero Triverio @modelics]

Nhien shows a new result potentially relevant to CABG failure: abnormal WSS area is correlated to graft remodeling 1y after surgery

https://t.co/AavxHjzAww

with A. Yan, S. Fremes, @LJimenezJuan

@RSNA @bme_uoft
@eceuoft @uoftengineering @UofT
@Sunnybrook
@UnityHealthTO

[Piero Triverio @modelics]

Highlights:
- Top-Notch 4-day Program
- Four Awards
- Tutorials (a full day)
- IEEE Education Credits
- Publication in IEEEXplore (and IEEE CPMT special issue for selected papers)
- Student Travel Grants
- Exhibit & sponsorship opportunities:
https://t.co/blDovRHbU0

[Piero Triverio @modelics]

EPEPS2023 will be on October 15-18 in Milpitas, CA! Join the leading conference on the electrical performance of chips, packages & systems! https://t.co/SrtHtL2iDd

Submit your paper by July 17:
https://t.co/ET76v7FkJv

#signalintegrity #powerintegrity #packaging @IEEE_EPEPS

[Piero Triverio @modelics]

Package Design Engineer opening at @tenstorrent !
https://t.co/A9y4oowciT

[Piero Triverio @modelics]

Public preprint: https://t.co/sC3XC9FIa8

Monday at 17:30 at hashtag #eucap2023 (room: Spadolini 106) we present the full formulation valid from DC to very high frequency - like Maxwell's equations!

[Piero Triverio @modelics]

Just published: a fresh, generalized look at the DC analysis of conductors with integral equations, including for R, L, C extraction. By Shashwat Sharma and I. Supported by: @AMD @NSERC_CRSNG
@eceuoft @uoftengineering @UofT @CMCMicrosystems

https://t.co/f54RJ361a8