$TSM $MU $DRAM $ASX $AMKR
CoWoS: 8 to 12 HBM stacks
CoPoS (2028): up to 16 HBM stacks
Next gen (2029): up to 24 HBM stacks
Advanced Packaging innovation IS memory demand growth. TSMC is spending billions to remove the only physical limit on how much memory ships with every GPU.