Lam Research and DISCO were named on NT$2.609 billion of operating-equipment purchases by ASE subsidiaries. SPIL acquired four Lam batches totaling NT$1.604 billion from July 22 through November 11; ASE acquired one DISCO batch totaling NT$1.005 billion from August 6 through November 11.
SPIL separately awarded Zhongyuan M&E a NT$1.196 billion facility-engineering contract covering November 3-11. The construction term runs through December 31, 2028.
The filings show increasing equipment capex for the Taiwanese testing giant.
$ASX ASE Technology | $LRCX Lam Research | $DSCSY DISCO
South Korea exported US$16.632 billion of semiconductors in November’s first ten days, up 331.2% from a year earlier. Chips accounted for 49.7% of the country’s total exports, up 25.3 percentage points.
Total exports reached US$33.5 billion, up 111.9%. Adjusted for the number of working days, overall exports still rose 97.7%.
The preliminary release shows exceptionally strong semiconductor export receipts carrying into November after October’s record month.
$SKHY SK Hynix | $005930.KS Samsung Electronics | $DRAM Roundhill Memory ETF
Samsung Electronics plans to bring AMD's EPYC Embedded 9006 processors into its memory and storage manufacturing-test infrastructure. The setup pairs the CPUs with Samsung DDR5 RDIMM and MRDIMM, its PCIe Gen 6 PM1763 SSD and CXL 3.2 CMM-D MD310.
The embedded CPUs act as the control engine for production-scale validation, managing memory and storage test workloads and running more tests in parallel. The platform supports up to 256 cores, 16 DDR5 channels and 96 PCIe Gen 6 lanes.
AMD plans to make the 128-core model available November 15, with the remaining models expected to begin shipping by year-end. For Samsung, the program expands the compute and I/O behind testing its next generation of memory and storage devices.
$AMD Advanced Micro Devices | $005930.KS Samsung Electronics | $DRAM Roundhill Memory ETF
SK hynix's LPDDR5X DRAM has obtained IEC 61508 SIL 3 certification for industrial functional safety, while the company's vehicle-cybersecurity management process has been certified against ISO/SAE 21434. SGS-TÜV Saar assessed both programs.
The LPDDR5X qualification covers continuous-mode operation and the development process, creating a certified low-power memory path for robot controls, edge AI and smart factories. The cybersecurity review spans development and mass-production procedures for automotive products.
The milestone extends SK hynix's safety credentials from automotive memory into industrial physical-AI systems, where memory carries sensor inputs, AI results and security keys.
$SKHY SK hynix | $DRAM Roundhill Memory ETF
TSMC's board authorized investments of up to US$500 million each in Anthropic and OpenAI, putting as much as US$1 billion directly into two leading AI-model developers.
The Anthropic investment would acquire common shares at the company's initial public offering price. The OpenAI investment would acquire preferred stock. TSMC also approved up to US$500 million to establish a separate investment company for semiconductor-industry and ecosystem stakes.
The move gives the world's largest pure-play foundry direct financial exposure to companies whose model development drives demand for accelerators, advanced wafers and packaging. The separate vehicle creates a standing route for further ecosystem investments.
$TSM TSMC | $ANT Anthropic
MediaTek reported October consolidated revenue of NT$55.03 billion, up 5.8% from a year earlier and 0.7% below September.
The chip designer began initial shipments of its first custom data-center AI accelerator in September. In its October 30 results, MediaTek forecast US$2.5 billion of fourth-quarter revenue from the program and said it was working with supply-chain partners for additional capacity. The first customer is believed to be Google.
October leaves NT$155.1–166.8 billion of MediaTek's NT$210.1–221.8 billion fourth-quarter guidance for November and December. The required monthly average is 41–52% above October, concentrating the guided accelerator step-up in the final two months.
$2454.TW MediaTek | $TWN Tawain Fund | $EWT iShares Taiwan
TSMC's board approved approximately US$40.93 billion of capital appropriations for advanced-process capacity, advanced packaging and specialty capacity, fab construction, facility systems and 2027 R&D investment.
The approval follows TSMC's October guidance that 2026 capex will reach US$60-64 billion and that spending from 2026 through 2028 will run significantly above the previous three years. Management said customer demand is robust across a multiyear horizon and tool supply remains tight.
$TSM TSMC
@Seanfrank Would be interesting if any of these Mercor/Micro1 referral farmers are generating significant revenue or if its just $10k here, $50k there, etc
ChipMOS named Advantest Taiwan on NT$805.5 million of machinery and related accessories acquired from April 8 through November 10 for manufacturing use.
ChipMOS packages and tests memory, display-driver and mixed-signal chips. Its annual filing describes test equipment as the most capital-intensive part of its memory and logic/mixed-signal test business, while its November 10 results tied current capacity expansion to customer forecasts and long-term supply agreements.
The purchase places Advantest directly in ChipMOS's expanding test-equipment base as the OSAT adds capacity for a record quarterly revenue run.
$8150.TW / $IMOS ChipMOS Technologies | $6857.T Advantest
ASE packages semiconductor dies, connects them to substrates and tests their performance before shipment to electronics manufacturers. Its group also operates an electronics-manufacturing business.
Consolidated October revenue reached NT$88.62 billion, up 47.1% year on year and 0.6% sequentially. The semiconductor assembly, testing and materials business added NT$4.17 billion from September, accounting for roughly 64% of group revenue versus 60% a month earlier.
The segment breakdown shows semiconductor packaging and testing accelerating much faster than the consolidated monthly growth rate.
$ASX ASE Technology
Malaysia's printed circuit board output index rose 53.2% from a year earlier in September. Output of semiconductors increased 17.9%.
The two categories moved in opposite directions from August: semiconductor-device output rose 7.1%, while PCB output eased 3.7%. For Q3, their output indices were 14.9% and 49.0% above the year-earlier quarter, respectively.
Malaysia's broader computer, electronic and optical products index increased 17.3% year on year. The September split shows board production growing faster than chip-device output across the country's electronics manufacturing base. Companies building, assembling and testing PCBs in Malaysia include TTM Technologies, AT&S, EliteMaterial, Flex, Jabil, Celestica and Sanmina
$TTMI TTM Technologies | $FLEX Flex | $SANM Sanmina
Wafer Works reported October revenue of NT$1.036 billion, up 20.2% from a year earlier. Sales have climbed from NT$966 million in June to NT$994 million in July and NT$1.004 billion in August.
Wafer Works supplies polished silicon, epitaxial and SOI wafers.
$6182.TWO Wafer Works | $SUOPY SUMCO | $SHECY Shin-etsu Chemical | $6488.TWO GlobalWafers
ChipMOS reported October revenue of NT$2.85 billion, up 30.9% year on year and 2.1% from September, its highest monthly sales of 2026.
The company packages and tests memory and display-driver chips and provides wafer bumping. Its disclosed major customers include Micron, Nanya, Winbond, Macronix and Phison.
In its October 8 update, ChipMOS said AI-related demand was outpacing available memory supply and that new capacity was being deployed against existing customer forecasts and long-term supply agreements. October sales were another 1.8% above the monthly average of its record third quarter.
$IMOS ChipMOS | $MU Micron
Alchip's October consolidated revenue reached NT$10.26 billion, up 515.8% from a year earlier.
Alchip provides design and production services for custom ASICs and SoCs, including advanced packaging and manufacturing management. A 3nm AI accelerator for a North American customer (believed to be Amazon) began shipping in May and moved into large-scale production during Q3. Alchip said the program should bring Q4 revenue to a new high.
The company's next 2nm accelerator program is approaching tape-out, with volume production planned before the end of 2027.
$3661.TW Alchip | $TWN Taiwan Fund | $EWT iShares Taiwan
Delta Electronics reported October consolidated sales of NT$74.67 billion, up 30.1% from a year earlier and 14.2% from September.
Delta supplies power electronics, fans and thermal management, industrial automation and data-center infrastructure. The October growth is a signal across power and cooling demand.
$2308.TW Delta Electronics | $PSOX Tema MLCC & Powersemi ETF
SCHMID has won a wet-process equipment order from a US based glass advanced packaging developer for a South Asia plant planned to produce approximately 70,000 glass panels a year.
The equipment supports through-glass-via formation, metallization and build-up layers: the chemical-process steps that turn glass cores into high-density interconnect substrates. SCHMID will record the order in its fourth-quarter 2026 order intake.
The customer plans glass interposers and 3D heterogeneous-integration modules for AI, data-center, 5G and aerospace systems. The project moves its photo-definable glass-ceramic and TGV technology from pilot work toward industrial-scale manufacturing.
$SHMD SCHMID Group
Winbond is expanding its 16nm specialty DRAM portfolio with 16Gb DDR4 and 16Gb LPDDR4 devices. Availability is scheduled by year-end 2026, with mass production planned for Q2 2027.
The same platform adds an 8Gb LPDDR4 x16 device. The 16Gb DDR4 targets switches and server peripherals, while the 16Gb LPDDR4 targets automotive systems and AI image-signal-processing applications including drones and surveillance.
Winbond makes specialty memory at 12-inch fabs in Taichung and Kaohsiung. The higher-density products fill gaps in its established DDR4 and LPDDR4 portfolio and increase memory units produced from available wafer capacity.
$2344.TW Winbond Electronics | $DRAM Roundhill Memory ETF