ELON MUSK: “That’s the car that I was driving around LA for like three years. And because I thought, well, it’s the first flight of Falcon Heavy, probably going to fail. But we don’t want to put something boring on it, like, you know, I think Boeing or whatever would put like a concrete block, which is extremely boring.
So, we put Starman flying around, and he’s still up there. The car is orbiting between Earth and Mars. So, and we’ll be up there, I think, for at least 10 million years.”
AI BUILDOUT DESK · 22 Jul
Binding constraint:
DRAM DDR5 remains the tightest point in the AI supply chain: 86 (CRITICAL). HBM3e remains second.
What changed today:
- BNEF now sees US data center electricity demand up 83% by 2035. Power and interconnection remain the long pole.
- Silicon Motion extended its memory shortage view through H2 2028, reinforcing that the DRAM squeeze isn’t a one-year event.
- ABF substrate pricing continued to rise, adding another sign that packaging remains under pressure.
Next tests:
Shin-Etsu (materials), Disco (wafer processing), and BE Semiconductor (hybrid bonding) report tomorrow.
Falsifier:
Server DDR5 contract pricing turns QoQ negative.
Until then, DRAM DDR5 remains the binding constraint.
https://t.co/T77z5tohwv