Xpeedic

Xpeedic Technology, Inc. is a global leading provider of EDA software, Integrated Passive Device (IPD), and System-in-Package (SiP) design solution.

[Xpeedic @xpeedic]

Xpeedic's EDA solutions for AI terminals, encompassing chiplet, package, and system levels.
Sign up for a meeting at Xpeedic #DAC Booth #1431.
https://t.co/DyToHItngs

[Daniel Payne @Daniel_J_Payne]

Doing 3D IC design? Check out Xpeedic for using an Electromagnetic field solver for advanced, multi-die packaging analysis. Metis is the #SemiEDA tool name. Ask for Feng Ling, founder and CEO at booth 1443 at #59DAC.

[Xpeedic @xpeedic]

Xpeedic will showcase our latest 3DIC and High Speed Digital solutions at the #DesignCon 2022 in Santa Clara, April 5-7. Visit us at booth #727 to learn more about our simulation-driven EDA solutions and our newly-published paper.
https://t.co/i2X73AerPJ

[Xpeedic @xpeedic]

Xpeedic will showcase its latest solutions at DAC 2021. Join us at Booth#1357 to discuss our simulation-centric EDA solutions across chip, package, and system. #DAC2021 #58thDAC
https://t.co/2NI47YiYzr

[Xpeedic @xpeedic]

#SAFE Forum 2021
As Samsung Advanced Foundry Ecosystem (SAFE™) partner, Xpeedic will be showcasing its latest solutions of Advanced Nodes and Advanced Packaging at the virtual Samsung Foundry Forum 2021 on November 17.
Detail Solutions here:
https://t.co/CioWiWyZVA

[Xpeedic @xpeedic]

Xpeedic is showcasing its latest solutions at the GF Technology Summit 2021. Join us at our virtual booth.

We hope to see you there! #Xpeedic #GFTech2021

[Xpeedic @xpeedic]

#DesignCon Day 3: Xpeedic is also unveiling its high-speed EDA Solution 2021 today at DesignCon. Join us at the San Jose McEnery Convention Center in San Jose, CA for the presentation. Hope to see you there! @DesignConEvent
https://t.co/l44khlYxIm

[Xpeedic @xpeedic]

#DesignCon Day 3: Xpeedic is presenting two technical papers today. Hope to see you there!

1. Signal Integrity Analysis in Immersion Liquid Cooling
Time: 2:00-2:40pm
Meeting Room 212AB

2. Optimizing BGA Ball Pattern for Signal Integrity
Time: 3:00-3:40pm
Exec Ballroom 210A

[Xpeedic @xpeedic]

Stop by our booth 913 to meet @xpeedic team and learn more about our new 2021 high-speed SI release, interposer and package simulation tool Metis and more. #DesignCon

[Xpeedic @xpeedic]

Xpeedic will be presenting at DesignCon on August 18th, 2021! Visit us at booth #913 to learn more about our simulation-driven EDA solutions and our two newly-published papers @DesignConEvent
https://t.co/Snoo81woNA

[Xpeedic @xpeedic]

Xpeedic and Cisco will co-present a paper at IEEE EMC+SIPI 2021. Visit our virtual session on August 11th from 11:00 to 13:00 EDT to learn more. We look forward to seeing you there!
https://t.co/TkdHdOvwcz

[Xpeedic @xpeedic]

Xpeedic will be showcasing its latest RF solution at the 2021 IEEE MTT-S International Microwave Symposium (IMS)! Our virtual exhibition hours are June 22-23rd from 9:00-5:00 EDT and June 24th from 9:00-4:00 EDT. Join our virtual booth to find out more!
https://t.co/q3FRtrYfRx

[Xpeedic @xpeedic]

We are excited to announce that our on-chip passive EM simulation suite has been certified by Samsung Foundry on its advanced 8LPP (8nm Lower Power Plus) process technology! Click the link below to find out more about this exciting partnership!
https://t.co/X1c91H8OfA

[Yole Group @YoleGroup]

📧 I-MICRONEWS #NEWSLETTER |
#IPD platforms – A new approach to passives in #RF front-end modules – Interview with @xpeedic : https://t.co/tMSSdEKsI3
- @Cruise and @GM team up with @Microsoft to commercialize self-driving #vehicles
- More on https://t.co/CFgmdDRo41
#RFFE

[Xpeedic @xpeedic]

Had a wonderful interview with i-Micronews covering IPD platforms. Feel free to check it out!
https://t.co/fH0IfpK0QL

[Xpeedic @xpeedic]

Introducing ChannelExpert: your go-to for pre-layout SerDes channel analysis! In this video, you will learn to create a channel by template and run a SerDes channel analysis. We hope you enjoy!
https://t.co/fW1oylYj8J

[Xpeedic @xpeedic]

Xpeedic will be exhibiting at IMS 2020!
Join us online at our virtual booth from August 4-6 as we showcase our latest 5G RF solution. Visit our website for more details.
We hope to see you at #IMS2020! #5G #EDA
https://t.co/vA1WaaHOrn

[Xpeedic @xpeedic]

Introducing TmlExpert: an efficient way to build transmission lines and run simulations. Through different built-in templates, TmlExpert allows you to quickly establish various models. It also help you solve 2D, 2.5D, and 3D problems. We hope you enjoy!
https://t.co/578R8C7C9K

[Xpeedic @xpeedic]

We're proud to present Heracles, our very own sign-off tool used in modern high-speed PCB layout! In this video, you will learn how to implement a smooth flow from board file import to net selection to comprehensive check. We hope you enjoy!
https://t.co/3RUqRUK7Ys

[Xpeedic @xpeedic]

Introducting ViaExpert: a via-centric CAD tool for construction and EM analysis of via related structures! In this video, you will learn how to easily parameterize and optimize vias. We hope you enjoy!
https://t.co/M73CQyEHjI