@illyquid $E28.SI! Market underestimating one of their top customer’s $TMO inflection (they have exposure to AI materials segment that will come through soon). AMAT committed certain volume to them + ASML ramp in 2H. These 3 will help them get 1B rev by 2027, earlier than expectations.
@phithetasigma and Micron will be enough to offset outsource manufacturing. If Intel ramps, even though margins will not be as good, it will be higher than prior years as AEM owns their own technology now vs co engineering in the past. Dollar accretive margin neutral.
@phithetasigma Why do you think AEM somewhat priced in? The ramp for AMD yes but not the ramp for Intel, ASE and Micron. Intel’s installed base of machines is not AMPS and will have a refresh if IFS picks up with HPC chips. For ASE, AEM’s PIXL tech will also spur a refresh vs their aging base.
@illyquid Bullish for Frencken and UMS. In particular Frencken as this facility coincides with with Frencken’s new factory that is going to be completed early next year. Hearing that they are pushing for the facility to be completed as soon as end of this year. Surprised E28 not up on this
@illyquid@phithetasigma Nice. Not the most levered but upside is easily a double when compared to $AEHR. Package level and SLT test TAM vs wafer level is multiples bigger. $KLIC and ASMPT also crucial players in IFS you can consider to play with solid downside protection.
@illyquid@phithetasigma Dig deeper into PIXL. The intra chip thermal control was designed just for advanced packaging. Thermal control has to very precise given the different components in the chip, especially with the components being materially physically different from each other (HBM 12 high)
@illyquid@phithetasigma The fact that ASE needed to onboard AEM and invested into AEM speaks volumes about the IP AEM has. If given a choice, I do not think ASE would bother onboarding a micro cap if $TER and Advantest were able to solve the thermal issue.