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Embedded Computing Design editor in chief, Ken Briodagh, interviews Frank Ferro, Group Director, IP Product Management at Cadence, for a discussion on system of Memory and Storage in the inaugural podcast episode of SystemChat. https://t.co/8FGbb03gNe
Synopsys and Amazon Announce Strategic, Multi-year IP Agreement for Custom Silicon; Collaboration Also Extends to Cloud and AI-Powered Engineering https://t.co/Wo2Lnigui1
Arteris Wins Funding to Expand Hardware Design Supply Chain Security Assurance for the Trusted and Assured Microelectronics Program
Government-funded initiative advances commercially sourced third-party IP security assurance for semiconductor systems... https://t.co/1wJeM0pK9J
Join the Synopsys webinar on October 15th to see how the industry's first 112G PHY IP compliant with OIF-CEI-112G-LINEAR-PAM4 was validated in silicon, meeting, and in some cases exceeding, the spec's transmitter and receiver electrical requirements. https://t.co/UzocGwouPt
Cadence-Intel UCIe Interoperability Demo at Chiplet Summit 2026
Intel Product Line Manager and co-chair of UCIe Marketing Working Group, Stephen Wong, demonstrated joint Cadence-Intel UCIe interoperability. Watch the Intel-Cadence demo... https://t.co/WOSO1Hklyc
GUC Announces 2nm 16 Gbps HBM4E IP
Its HBM4E PHY and Controller IP is design-ready and has been adopted in customer AI ASICs. Implemented on TSMC’s cutting-edge N2P process, the HBM4E PHY has successfully taped out on TSMC CoWoS®-L advanced packaging... https://t.co/ChXFPjZGdb
A holistic and optimized approach to embedded cybersecurity
Artificial Intelligence and Post-Quantum Cryptography are reshaping the cybersecurity landscape for embedded systems... Watch the presentation from IP SoC Days Korea 26 https://t.co/PKFU4GDO0W
GlobalFoundries and Monolithic Power Systems form manufacturing partnership to scale high-performance power solutions
New agreement brings MPS power management solutions to GF’s Singapore fab for volume production in 2027 https://t.co/SwikIGt9M6
Samsung Foundry and Cadence Expand AI Design Ecosystem for Next-Generation AI Infrastructure and Physical AI
Today, AI is driving a fundamental shift in semiconductor design. Delivering next-generation AI systems requires... Read the Samsung blog>> https://t.co/s05eb1sa9r
The Intersection Of AI And Voice At The Edge
Increasingly capable natural language processing is changing how audio systems are designed, integrated, and perceived... Watch now>> https://t.co/erYs6Cmg7x
Silicon Creations Receives 10th Consecutive TSMC OIP Partner of the Year Award for Mixed Signal IP
Recognition reflects over 15 years of collaboration and production success supporting customers across advanced TSMC process technologies https://t.co/c0MNI54hRh
Shift Verification Left: AI Tools for Faster, Smarter Chip Design
Verification activities can consume up to 70% of an overall chip project's effort, underscoring the central challenge that verification poses... Read the Cadence Tech Talk article>> https://t.co/UNHg8RZuSD
Cadence Collaborates with TSMC to Deliver Certified Tool Solutions and Industry-Leading, Silicon-Proven UALink IP on TSMC Advanced Processes
Expanded partnership spans TSMC A14 certification, silicon-proven IP on TSMC N3P/N2P, wafer-scale 3D-IC for... https://t.co/tMiZaY92RR
Rambus Enhances Enterprise-Grade Security for Data Center and AI SoCs with CryptoManager™ Root of Trust Supporting the Caliptra™ Specification https://t.co/aqxemk5dnJ
S2C Named Andes Technology’s 2026 Partner of the Year
Companies to demonstrate AndesCore™ AX66 RISC-V processor running Linux KVM virtualization and AI inference on S2C’s Prodigy™ S8-100 at AI Infra Summit https://t.co/lHjRFKOu4Q