Thermal 2021 starts next week. Get signed up to network with the biggest thought leaders in the thermal and electronics industry!
https://t.co/goQSEHZwMh
The new @fujipoly SARCON SPG-25B-NS from Fujipoly is an easy to dispense, low- viscosity, silicone free compound that exhibits a thermal conductivity of 2.5 W/m°K and a thermal resistance of 2.1°K•cm2/W.
https://t.co/44Qz2c9CRJ
Session Spotlight - High Thermal Conductivity Thermal Interface Materials Based on an Epoxy Matrix
By Kevin Roth, Project Manager, High Performance Materials -ADA Technologies, Inc.
https://t.co/qrAg5jYLMb
The 2021 Advancements in Thermal Management Conference is fast approaching. Register for this conference, being hosted virtually on Aug. 4-5.
The event will feature two full days of speakers, online expo hall, personalized 1 on 1 meetings
https://t.co/goQSEIh8aR
Thermal Conference Session Spotlight - San Jose State University @SanJoseSt
Session Spotlight - PCM and Heat Pipes for Temperature Reduction in Electric Vehicle Batteries - Dr. Sohail Zaidi, Mechanical Engineering Department - San Jose St. University
https://t.co/cOKWpiT5ep
New Session Alert from @MSCSoftware
10x Productivity in Thermal Simulation on Battery Pack Designs -
Speaker: Yuya Ando, CFD and Multiphysics Business Manager in North America - Hexagon/MSC Software https://t.co/EZsVDK9KHr
@SemiconductorD has signed on to be a media supporter of the Advancements in Thermal Management 2021 conference.
https://t.co/xoHes8tJix
Subscribe to Semiconductor Digest to get news and industry trends delivered to your inbox. https://t.co/B6n3RyxBwu
Early Bird Pricing for the Advancements in Thermal Management Conference end June 18th.
Take advantage of early bird pricing and attend the Conference.
Registration - https://t.co/gP3yTziKRl
Program - https://t.co/EZsVDK9KHr
Participating Companies - https://t.co/n0P5S0rv8s
Session Spotlight for Thermal 2021 - Predicting Thermal Design Reliability with Simulation Based Surrogate Models - Speaker: John Wilson, Electronics Business Development Manager - @mentor_graphics, Digital Industries Software @Siemens
https://t.co/EZsVDJS9iR
New Session Announcement - Maximizing Thermal Interface Material Performance in High-Reliability Applications from @NanoramicLabs Day 2 - 12:30PM
https://t.co/qrAg5jYLMb
Thermal Conference 2021 - Program Announced
Join companies such as @Fujitsu_Global , @mentor_graphics, University of Maryland, Hymet Thermal, Vanguard Products Corporation, @VirginiaTech_ME and many more in this jam packed program.
https://t.co/EZsVDJS9iR