Intel

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[Intel Foundry @Intel_Foundry]

Advancing semiconductor performance isn't just about smaller transistors.

Innovations in advanced packaging, like hybrid bonding, enable denser chip-to-chip connections and create new opportunities for performance and power efficiency. But bringing these technologies to life requires extraordinary manufacturing precision.

Discover the engineering behind next-generation semiconductor packaging.

Watch the full conversation: https://t.co/ymlh3GguH8

#IntelFoundry

[Intel @intel]

@alex_warne We couldn't agree more 💙

[Intel @intel]

@onchainantonio Great point. PQC shouldn't be treated as a software-only migration. In the report, we cover how we're bringing quantum-resistant authentication into firmware and platform security, since some of the longest-lived trust anchors are rooted in hardware.

[Intel @intel]

Security is evolving. So are the technologies that protect our data.

Learn how Intel is advancing trusted computing through innovations in confidential AI, post-quantum cryptography, and more.

Read the full 2026 report: https://t.co/Xc2BUBAwBt

[Intel @intel]

@magicsilicon Looks like @OscarPiastri added a few extra cores for race weekend 👀

[Intel @intel]

Meeting sovereignty requirements shouldn't limit possibilities. Together with @Microsoft, we're helping organizations balance control, security, and flexibility across their workloads.

[Microsoft Azure @Azure]

Digital sovereignty requirements vary by workload, and they keep changing. Microsoft and @Intel are building a consistent foundation from edge to cloud, so you can run AI where your data lives, with controls you can verify.

Learn more: https://t.co/wqxnIscowa

[Intel @intel]

Performance isn’t just achieved, it’s engineered.
Check out @oscarpiastri’s limited-edition @mclarenf1 & Intel helmet this weekend in AustinPerformance isn’t just achieved, it’s engineered.
Check out @oscarpiastri’s limited-edition @mclarenf1 & Intel helmet this weekend in AustinPerformance isn’t just achieved, it’s engineered.
Check out @oscarpiastri’s limited-edition @mclarenf1 & Intel helmet this weekend in AustinPerformance isn’t just achieved, it’s engineered.
Check out @oscarpiastri’s limited-edition @mclarenf1 & Intel helmet this weekend in AustinPerformance isn’t just achieved, it’s engineered.
Check out @oscarpiastri’s limited-edition @mclarenf1 & Intel helmet this weekend in Austin.

[McLaren Mastercard Formula 1 Team @McLarenF1]

OP's US GP lid with @intel ✨

#McLarenF1 | #UnitedStatesGP 🇺🇸

[Intel @intel]

Catch @oscarpiastri if you can. He’ll be rocking a new look at the race in Austin, courtesy of our partnership with @mclarenf1.

[Intel @intel]

@McLarenF1 The Intel is on the outside this time.

[Intel @intel]

It's go time!

[McLaren Mastercard Formula 1 Team @McLarenF1]

New lid just dropped @intel ✨

#McLarenF1 | #UnitedStatesGP 🇺🇸

[Intel @intel]

@trossenrobotics And thank you, @trossenrobotics, for putting Intel-powered physical AI on display!

[Intel @intel]

@Bechtel Seriously excellent work on the Ohio fab, @Bechtel! We're grateful for your team's expertise, innovation, and dedication as we build the next generation of American semiconductor manufacturing.

[Intel @intel]

@MyVMUG Thanks for the highlight, @MyVMUG! 💎

[Intel @intel]

@asheaw Excellent conversation between Dwarkesh and Intel manufacturing leadership highlighting the manufacturing innovations shaping the future of computing and exploring the industry's biggest questions. Thanks for putting the spotlight on this, Annie!

[Intel @intel]

@dwarkesh_sp Now that you mention it...

[Dwarkesh Patel @dwarkesh_sp]

I spent two days touring Intel’s most advanced fab and talking to its technical leadership to understand what the chips of the future will look like.

A lot of what's coming next – gate-all-around transistors, backside power, CFET, hybrid bonding – is hard to follow without actually seeing it, so we made all the awesome animated explainers that I wish I had while I was prepping.

I also asked Intel’s leadership how the semiconductor industry will cope with the enormous shock in demand from AI.

AI compute has grown 3x a year for the last decade, but according to Intel's CTO, Intel could only double leading-edge wafer production with today’s global stock of chipmaking tools.

What kinds of tricks can foundries pull to extend this crossover point where demand surges way ahead of supply?

This was a totally new format for us - hope you enjoy!

0:00:00 – Intro
0:00:47 – How Intel brings up a new process node
0:03:22 – What Intel learned from 10nm
0:06:28 – From planar transistors to gate-all-around
0:13:13 – Why High-NA EUV pays off for Intel but not TSMC
0:19:20 – Could chips have evolved completely differently?
0:23:33 – Inside Intel's "Hot Topics" meeting
0:29:30 – Replacing copper wires with ruthenium
0:32:41 – Why stacked transistors take a decade to ship
0:39:45 – Hybrid bonding and the chip-to-chip bottleneck
0:48:00 – There aren't enough tools to 10x chip production
0:53:14 – Can Intel catch up to TSMC?
1:01:02 – Terafab, and rethinking the fab from scratch

[Intel @intel]

What does it really take to make the world's most advanced chips?

Thousands of intricate manufacturing steps. Extraordinary engineering precision. And an industry working to meet growing global demand for computing.

Get an inside look at Intel's semiconductor innovation as Chris Auth, Pushkar Ranade, and other Intel experts join @dwarkeshpodcast to explore the science, technology, and manufacturing expertise behind advanced chips.

Watch the full conversation: https://t.co/KWt9uynnFY

[Intel @intel]

@asheaw By expanding semiconductor manufacturing across the nation, we're demonstrating what "Made in America" truly means. Together with our suppliers, partners, and communities, we're building the foundation for the technologies of tomorrow.