📆 EMINT |
Jerome Azemar (@Yole_JAZ) proposes a dedicated presentation on the #lithography industry with supply chain analysis and key market & #technology trends at EMINT Frühjahrstagung 2019. Yole would like to thank @VDMAeu for its warm welcome.
More on https://t.co/Sfj5pHigaQ
📈 #CMOS CAMERA MODULES |
“Despite headwinds the #CCM market remains highly attractive,” states Pierre Cambou @Yole_Dev. The #camera module industry has reached a new stage in its development, it showing an impressive US$45.7 billion market by 2024. #CIS
https://t.co/yVwftgODRi
📆 GaN Con - Power #GaN |
Yole's team is ready to welcome you! Do not hesitate to visit us in Milpitas. #GaNCon@Yole_JAZ
More info on https://t.co/yDnCR8cxFm
📈 APPLE WATCH - #SIP |
@system_plus , partner of @Yole_Dev reveals in a new report the 4 main packaging technologies selected by #Apple for the Watch Series 4. #packaging#SiP#InFO#reversecosting
A detailed description of this report is available on https://t.co/6h02QMzcw6
Finally an answer of Samsung to TSMC's InFO. First Fan-Out on panel of SEMCO used as package for an APU (and we have performed the teardown): https://t.co/L5s0Zx27wq #tsmc#samsung#advancedpackaging#panel#fanout
📆SEMICON TAIWAN | Sept 6, 2018 - 1PM
"Advanced Packaging for High-end Applications" presentation by Jerome Azemar from @Yole_Dev at the #SEMICONTaiwan SIP Global Summit.
🎙️Full presentation available soon on https://t.co/WS7lebTgYd, stay tuned! https://t.co/YdHH0MVSW5
Here’s a #RealityCheck on the #timeline for #selfdrivingcars becoming mainstream, thanks to @Yole_Dev. Along the way, collaborative innovation within our industry will help deliver technologies to keep #drivers and society safe, secure, and on the right track, literally. #AI#SiP