Zai was gracious enough to give me a key to test out GLM 5.2. I used it on a few simple tasks and quickly realized this model is on another level.
I committed to using GLM 5.2 solely for the weekend and yesterday on everything from simple data analysis, random queries, side projects, and real work, and I can honestly say this is the first open model that I could comfortably replace Opus 4.8/GPT 5.5 with. It’s THAT good. When I say everything, I mean everything. I never needed to fallback to GPT 5.5 or Opus 4.8. This really blew my mind.
I was unable to find any task where I knew GPT 5.5 or Opus 4.8 could solve, but GLM 5.2 could not, and I actually found a few cases where GLM 5.2 was better. I am not trying to overhype anything here. It's just my actual experience with this model. It was of course only 3ish days of usage, maybe cracks would form in time, but the perf is staggering imo.
I see it's an "inferior" model on the benchmarks even Zai has shared, but I am not so sure and I think this is the first time I've experienced that with an open model. I am not saying it's necessarily better, but I believe it's a replacement that you could run on-prem, which is crazy to me.
It was to the point where I was double triple quadruple checking that I wasn't accidentally running Opus or GPT. I ran thru both Hermes and my own custom coding agent harness with extremely great success.
I cannot believe this is only a 754B model that's also an open MIT licensed model. Do not sleep on this one, and definitely try it out.
Get it locally if you can!
Can I find a way to run it locally? That’s a different question, but I will be trying to get it done because this model is epic.
China's electrification of HDT sector continues unabated. It increased to 30821 unit in May, 2nd highest month ever (behind only the Dec rush b4 subsidy changes).
We are now solidly in the 30+% range every month. I don't know why the Chinese govt keeps saying dumb things like 40% by 2030 when eHDT penetration will be well over 50% soon.
하이닉스, 연말 375단 낸드 양산…몰리브덴 첫 도입
1/ SK하이닉스가 올해 연말 375단 3D 낸드플래시를 양산한다.
2/ 청주 M15 기존 라인을 전환하는 방식으로 진행되며 신규 증설은 없다.
3/ 당초 400단급으로 검토됐으나 양산 난도로 375단으로 조정됐고 이후 480단, 604단 로드맵이 예정돼 있다.
4/ 핵심은 몰리브덴 소재 첫 도입이다. 워드라인 금속 전극 일부를 기존 텅스텐에서 몰리브덴으로 바꿔 고단 적층 시 저항 문제를 해결하고 신호 전달 속도를 높인다.
5/ 몰리브덴은 보조막 없이 채울 수 있어 밀도 향상도 가능하다. SK하이닉스는 도쿄일렉트론의 퍼니스 방식 장비를 선택했다.
6/ 삼성전자는 이미 286단부터 몰리브덴을 적용 중이며 SK하이닉스도 이를 따라 고단 낸드 경쟁력을 강화할 전망이다.