Our platform makes unsupervised visual anomaly detection fast and easy, but it doesn’t stop there. AnomalyTDA also supports fully supervised tasks like object detection and multi-label classification with annotated datasets.
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@OfficialLoganK@GoogleAIStudio Hi @OfficialLoganK please add a proper search to the chat history, a bit more complex than just keyword search. With a lot of chats it's impossible to find anything. Also some RAG on top of the history would be great to be able to chat with it.
@skalskip92 I think the real hero of the today's announcement is SAM 3D with it's 3D volumetric reconstruction pop out of a single 2D image still feels like pure magic. This was my quick test today.
@AIatMeta When I see this 3D volumetric reconstruction pop out of a single 2D image still feels like pure magic, even if the underlying tech, like object segmentation and 3D synthesis has been developing for a while. Kudos Meta! Content creators should note!
@janusch_patas The biggest problem of this method is a reliance on COLMAP or similar tool, which in my experience uses the largest amount of resources. I suspect Depth-Anything-3 should be a better solution here. Independent comparison would be great.
At AnomalyTDA, we develop anomaly detection systems for these and many other semiconductor processes, ensuring every step, from bonding to inspection, performs flawlessly. [8/8]
The semiconductor industry is one of the miracles of our age - and here, for instance, is a wire bonding machine, one of the true workhorses of semiconductor packaging [1/8]
The system spots all these unique issues and, crucially, alerts the engineers instantly. This is how you move from just finding defects to preventing them.
We're moving past finding known issues. We're finding all anomalies: https://t.co/OhYP85GPFd
They produce 1,000 products a day. The problem? About 1% of them (10 units) have defects.
But here’s the real challenge I see all the time: the defects are never the same. One day it’s a microscopic scratch, the next a slight misalignment, the day after a material texture flaw.
Perfect for production lines already using standard image checks (labels, seals, fill levels) but wanting a second layer that actually adapts.
If your packaging inspection stops at classification, you’re missing half the picture: https://t.co/C1tuWNdqPz
Packaging inspection is changing fast - and “good enough” vision systems aren’t cutting it anymore.
Traditional vision systems catch known defects, but miss the unexpected. In high-speed packaging, that blind spot costs real money - recalls, rework, downtime.
That’s where AnomalyTDA steps in:
Instead of training on thousands of labeled defect samples, it uses Topological Data Analysis (TDA) to detect any irregularity — even those the system hasn’t seen before.