eWLB Technology

As a JCET Group Company,
STATS ChipPAC -- Market Leader in Fan-out #eWLB Technology

[Semiconductor Engineering @SemiEngineering]

Automotive Electronics: Driving The Semiconductor Market https://t.co/fgaroaY3yv
@SemicoResearch #semiconductor #automotive

[AI at the Edge @embedded_ai]

New frontiers in automotive HMI and display design https://t.co/K8OjodcjAf

[Ed Sperling @Chip_Insider]

Debugging and testing chips is becoming more time-consuming, more complicated, and significantly more difficult at advanced nodes as well as in advanced packages https://t.co/HdLS7xJn3g
#debug #semiEDA #7nm #5nm

[Semiconductor Engineering @SemiEngineering]

Bridges Vs. Interposers https://t.co/Caz5Ch8V09
#interposers #EMIB #AdvancedPackaging

[eWLB Technology @eWLB_Technology]

Higher Performance, Lower Power Everywhere https://t.co/upzqkjPgDJ

[Yole Group @YoleGroup]

Components for 3D Sensing Revolution | July 10th, 2018
Get @Yole_Dev and @system_plus expertise during a free #webcast analysing the key challenges of underlying sub-components for #3Dsensing in the consumer space.
Registration: https://t.co/7u43NN1veu

[SEMI @SEMIconex]

SEMI Blog - SEMI #China Members Gather to Promote China #Semiconductor Industry Growth. https://t.co/kRiZ9QZQlM

[Yole Group @YoleGroup]

Assist the free #Webinar organized by @SEMIconex with @Yole_Dev experts on the #Automotive #market.
From #radar, #LiDAR, #roboticcar, #sensor to EV/HEV electrification, #battery, #power #packaging, #compound #semiconductors and many more.
Register here: https://t.co/nE4cwlCoIA

[Ed Sperling @Chip_Insider]

IoT Wireless Battles Ahead: Tradeoffs include power, performance, security. Each standard has its own benefits and drawbacks https://t.co/NXY9iqprtL
#IoT #wireless #WiFi #Zigbee #80211AH

[Semiconductor Engineering @SemiEngineering]

Progress And Chaos On Road To Autonomy--> The incredibly complicated, frequently secretive & highly competitive world of self driving technology https://t.co/nb0fJMw95D
#selfdrivingcars #AutonomousVehicles

[eWLB Technology @eWLB_Technology]

#GSAEEF18 was a great event and we look forward to next year. https://t.co/io3r6FvrZS

[Global Semiconductor Alliance (GSA) @GlobalSemi]

Johannes Deichmann, Associate Partner at @McKinsey presents findings from a joint McKinsey-GSA study on future automotive electronics architectures. #Connectivity, #Mobility, #autonomousdriving and #electrification are the main architectures that need to be developed. #GSAEEF18

[Global Semiconductor Alliance (GSA) @GlobalSemi]

@GlobalSemi's Sandro Grigolli opening the 2018 European Executive Forum in Munich, Germany. Welcome to all attendees! #GSAEEF18

[eWLB Technology @eWLB_Technology]

#ECTC2018 continues with another day of advanced packaging information https://t.co/bKLdrrRUZX Don't miss the #IEEE seminar on High Density Packaging Technologies in the Era of Big Data @ 8pm.

[eWLB Technology @eWLB_Technology]

Hal Lasky shares his insight with Jeff Dorsch at Semiconductor Engineering on #OSAT consolidation. https://t.co/UqcUY2f3Po

[Semiconductor Engineering @SemiEngineering]

Big changes ahead in the OSAT industry https://t.co/MBb8JXslxt
#OSAT @asegroup_global #China #consolidation

[Ed Sperling @Chip_Insider]

Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS) https://t.co/34SjMGwILy
#substrate #Molded #interconnect #packaging #cryptocurrency

[Semiconductor Engineering @SemiEngineering]

Key reasons why packaging has taken on a whole new level of interest https://t.co/qW3hEonGeH
#packaging #automotive #ISO26262 #ISO16949