DeepSeek is going heavy-asset.
On June 9, the company posted an opening for IDC planning engineers, a role explicitly scoped to the design and delivery of MW-to-GW scale infrastructure. It follows April's hiring of data center O&M engineers in Ulanqab, Inner Mongolia. Taken together, this is the first time DeepSeek has fully shown its hand on owning compute infrastructure rather than just renting it.
Opendoor fires all Indian employees, closes Indian operations, brings jobs back to the U.S.
It's beginning. Every transnational corporation will pull out of India once their scamming and lying hits critical mass.
Got what I voted for...again.
Over the next 1 week…
Flat tape: Sellers $4.46B($1.13B out of the US)
Up tape: Sellers $0.97B ($1.83B out of the US)
Down tape: Sellers $20.52B ($6.05B out of the US)
Over the next 1 month…
Flat tape: Buyers $2.91B ($1.55B into the US)
Up tape: Buyers $38.84B ($2.74B into the US)
Down tape: Sellers $143.70B ($54.95B out of the US)
Source: GS
$SWMR is a few months post-IPO. the may 13 10-Q had 81% revenue decline, widened losses, and material internal control weaknesses. the auditors flagged going concern.
filed today: an S-1 and 8-K for a 24-month equity purchase facility with lucid capital markets. up to 3 million shares sold at 98% of VWAP. at current prices that's up to $146m in potential dilution hitting existing shareholders.
the first major capital move after going public is a deep-discount at-the-market facility. that's not a growth raise.
https://t.co/467iD3IXSd
Believe it or not…
TSMC engineers based in Hsinchu are personally saying the SA report is talking nonsense.
$TSM’s CPO mass production is still on schedule.
No delay.
Also supplementing the TSMC COUPE Platform Technology Roadmap shared by @semivision_tw. If you find this useful, please follow him as well!
#TSMC #CPO #COUPE
#Semianalysis
EXCLUSIVE: SK HYNIX TO MASS-PRODUCE 375-LAYER NAND WITH MOLYBDENUM
TLDR: SK Hynix is trying to improve NAND economics without triggering another supply glut.
SK Hynix is preparing to mass-produce 375-layer 3D NAND by year-end at its Cheongju M15 plant, using molybdenum for the first time in part of the word-line metal gate structure to replace tungsten, lower resistance, improve signal transmission and raise density in high-layer NAND.
#SKHynix #Samsung #Micron #NAND #3DNAND #MemoryChips #Semiconductors #KoreaSemis #KoreaMarkets #Molybdenum #Tungsten #ChipMaterials #AIInfrastructure $HXSCF $SSNLF $MU $DRAM $EWY $KORU $SMH $SOXX