Lightelligence

Harnessing light to power new possibilities

[STH @ServeTheHome]

Lightelligence showed off its Hummingbird AI inference chip with its optical NOC technology https://t.co/9vUe2nu741 @lightelligence @hotchipsorg #Hotchips2023

[Sally Ward-Foxton @sallywf]

.@Lightelligence has developed an optical NoC technology to connect chiplets, or in this case, cores on the same chip. Hummingbird is Lightelligence's all-new electronic AI accelerator ASIC with 64 cores connected for all-to-all broadcast.
#aihardware #ai
https://t.co/PHWvH9mKf5

[eeNews Europe @eeNewsEurope]

Demo of world’s first optical network-on-chip processor // https://t.co/aFiLcqDsk8

@lightelligence #optical #smart #electronics #semicunductor @nick_flaherty

[Lightelligence @lightelligence]

Read @sallywf and @eetimes insightful article on our Hummingbird oNOC accelerator here:

https://t.co/E3HyLVJmVd

[Lightelligence @lightelligence]

@lightelligence is thrilled to announce Hummingbird: the world’s first Optical Network-on-Chip (oNOC) processor designed for domain-specific #artificialintelligence (AI) workloads.

Read the press release here: https://t.co/WC5Iq2OSnC

Website: https://t.co/26Yeimyf7U

[Lightelligence @lightelligence]

“We’re changing the fundamental way computing is done, and I think we’re doing it at the right time in history. We believe optics will be the next computing platform, at least for linear operations like AI.” - @lightelligence CEO Yichen Shen

https://t.co/RMLiYywifi

[Lightelligence @lightelligence]

@lightelligence Hal Conklin joins a great lineup of speakers during @GlobalSemi 2023 Technology Symposium Thursday at Samsung Semiconductor in San Jose. His talk "Photonics, Compute and Interconnect" is part of the Artificial Intelligence Interest Group Session.

[Clive (Max) Maxfield @MaxMaxfield]

Air-Gapped Networks (Part 1): Air-Gapped Madness https://t.co/5wJSVJcAEo It’s not enough to have an air-gapped network—that network must be located in a secure facility, too.

[Lightelligence @lightelligence]

@lightelligence joins @GlobalSemi #photoniccompute #PACE

https://t.co/YmTvmDF4tx

[Semiconductor Engineering @SemiEngineering]

Photonics is poised for significant growth due a rapid increase in data volumes & the need to move that data quickly & w/minimal heat. But to reach its full potential #photonics will have to overcome production hurdles https://t.co/KORZrhH7ga
#siliconphotonics #photonicstest

[Clive (Max) Maxfield @MaxMaxfield]

#MaxCoolBeans: Willing to Provide Good Home to IBM System/360 Front Panel https://t.co/Ka7jVZ3PMY If you happen to be in possession of such a panel but are no longer able to care for it and wish it to go to a good home, then I’m your man. @eetimes @DesignNews @hackadayio

[Sally Ward-Foxton @sallywf]

Enfabrica has emerged from stealth with a new concept for relieving data center I/O bottlenecks, particularly common in #AI inference at scale. CEO Rochan Sankar told me its new accelerated computing fabric switch will replace multiple networking chips.
https://t.co/8QOme0iEA0

[Sally Ward-Foxton @sallywf]

Do AI and functional safety mix? I spoke to functional safety expert Michael Woon about AI in autonomous vehicles, quality managed software, diversified redundancy and consumer trust.
#av #autonomousvehicles #autonomousdriving #functionalsafety #ai
https://t.co/AYB1HhgXqk

[Semiconductor Engineering @SemiEngineering]

Creating real 3D designs is proving to be much more complex and difficult than 2.5D, requiring significant innovation in both technology and tools https://t.co/JnJpi79Iro
#3DIC #semiconductor #semiEDA #advancedpackaging #DieStacking #fanouts

[Lightelligence @lightelligence]

A great piece on @lightelligence when we launched Photonic Arithmetic Computing Engine (PACE) from @tomshardware & well worth a second look! #siliconphotonics #PACE #Moonstone #hardwaredesign #semiconductor #hardware #computing https://t.co/e2XzjCLzPJ

[Lightelligence @lightelligence]

“Heterogeneous tech architectures are ripe for 3D integration,” eplains @mbsteinman @Lightelligence VP eng @SemiEngineering True 3D Is Much Tougher Than 2.5D. “Consider mixed technology assemblies, such as a photonic IC w/its companion electronic IC..." https://t.co/zCmlwnyPMb

[Lightelligence @lightelligence]

@SemiEngineering “Self-Heating Issues Spread” asks "do you need to be concerned about each transistor & wire?" Rob Kuhn, physical design lead @lightelligence has an answer: “As the geometries of devices & wires decrease, current densities increase..." https://t.co/lBeQTTXXfG

[Semiconductor Engineering @SemiEngineering]

With every new node there are additional physical effects that must be considered, but not all of them are of the same level of criticality. One that is being mentioned more frequently is self-heating. https://t.co/fNEQZbxzFL
#heat #semiconductor #selfheating #powerdelivery

[Nitin Dahad @ndahad]

The @embedded_world flight from London. @embedded_online #ew23 #embeddedworld