maybe

chaos is ladder.

[maybe @maybe709394]

@follow_clues 韭菜源源不断

[maybe @maybe709394]

@y_cryptoanalyst @squidrouter @axelar 因为韭菜很多，不拿白不拿，募不到就降低点，这个圈子的韭菜很爱幻想。

[maybe @maybe709394]

@follow_clues 白天是那些傻逼接盘的？

[maybe @maybe709394]

@salonbus1024 老中每个月好像就几十亿美债到期，不算多吧

[Binance Wallet @BinanceWallet]

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[maybe @maybe709394]

@henryhuchina 请问你是从那里看出美债主要是老美自己内部在买？外资持续流出呢？

[maybe @maybe709394]

@mingyueth 是啊，柯南那个。现在有群吗？拉一个。

[maybe @maybe709394]

@jukan05 I hope to see your recommendations every week.

[maybe @maybe709394]

@predictdotfun brazil vs haiti. 2-0

[maybe @maybe709394]

@predictdotfun 2-0

[predict.fun @predictdotfun]

💰 We're giving away $1,000 💰

to enter:
1⃣ Predict the Brazil vs Haiti score in the comments
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[Arcium ☂️ @Arcium]

Arcium × @BinanceWallet Booster Campaign is live.

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[maybe @maybe709394]

@GrailCo so fast

[Amazing Nature @AmazingNature00]

Rain from a Distance

[maybe @maybe709394]

@GrailCo wow

[Compute King @Compute_King]

SemiAnalysis刚发了一篇文章，拆解了华为Mate 80系列中的麒麟9030，公开分析了SMIC N+3工艺的真实水平。

这篇分析值得关注的地方，不是标题里的那句：SMIC N+3工艺的金属间距比Intel 18A更小；而是一个更重要的现实：中国半导体并没有追上台积电和Intel，但也远没有被制裁锁死。

一句话表达：SMIC N+3已经超过了TSMC N6级别逻辑密度，但需要付出高于TSMC的工艺复杂度和制造成本；华为目前则正在试图用先进封装和3D堆叠来绕过EUV缺失带来的限制。

1，N+3本质上比TSMC N6略好一点

TSMC N6的密度在~108 MTr/mm²；SMIC N+3制程大概在~113 MTr/mm²。

2，令人震惊的是缩放能力

9030与9020面积几乎一样：约140平方毫米。但华为塞进去更多东西：
🔹 CPU核心从3中核变4中核
🔹 GPU从4 CU变6 CU
🔹 NPU扩大
🔹 Cache增加

全部放进同样面积。SMIC N+3带来了真实的密度提升。

读后感：

SemiAnalysis的结论可以概括为：

🔹 SMIC N+3 ≈ TSMC N6。
🔹 华为麒麟9030 ≈ 2022-2023年旗舰水平。
🔹 中国距离全球最先进工艺仍有明显差距，但出口管制并没有阻止其继续前进。
🔹 下一阶段，华为押注的不是EUV，而是LogicFolding，先进封装和3D系统级集成。

[maybe @maybe709394]

@798_eth 偏见很深。。。。