MZ’s mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground-breaking EDA software solutions.
@EPoSS Annual Forum in Braga, Paolo Prete from Monozukuri unveiled a novel approach: “Thermal-Aware Architectural Evaluation for 3D Advanced Packaging via Enhanced Compact Modeling” — a paradigm shift toward faster, thermally aware design exploration. #eposs#ThermalDesign
📌Monozukuri will be attending the EPoSS 2026 Annual #forum, taking place in Braga, Portugal, from June 16–19, 2026. On June 17, Paolo Prete will present: ✅“Thermal-Aware Architectural Evaluation for 3D Advanced Packaging via Enhanced Compact Modeling”.
https://t.co/ajVCEqxxMu
"HERMES COLLOQUIA". Appointment scheduled for 14 May 2026, from 10:15 to 12:15 CEST.
📌GENIOEVO, a 3D EDA co-design environment.
By Alfredo Babusci & team, MONOZUKURI, Italy.
Find the webinar using this link: https://t.co/FJdjVDedZh
MZ Solutions Expands Its Advanced Engineering Services, Forging a Strategic Synergy with MZ Technologies!
👇click on the link and find out more 👇
https://t.co/A9PS7Rxjjh
#solutions#technologies#embedded#innovation
Monozukuri wins the "America Innovation Award". A prestigious international recognition promoted by the Italy-USA Foundation, which celebrates MZ as one of the best innovative companies in Italy. The official award ceremony was held at the Chamber of Deputies in Rome on April 28.
MZ Technologies To Exhibit at Chiplet Summit Unveils GENIO EVO: Next Generation Chiplet/Package Design Tool.
👉 For further information, please link to the Press Release
https://t.co/IZ6C5eJP11
#chiplet#summit#genioevo#tool#innovations
Mike Gianfagna in his blog for #SemiWiki:
“MZ Technologies enables multi-die design by providing critical planning and analysis tools".
👉For further information, just click on this link.
https://t.co/geicHBdJEO
Learn how @mz_technologies #GENIO addresses the #systemarchitecture and #IC-package co-development flow to optimize the best approach for form factor, energy, performance, and cost.
👉Follow the link to @DanielNenni https://t.co/X3W9NsgIqX
Anna Fontanelli demonstrated MZ-GENIO, the first integrated IC/Packaging EDA tool, during the “Advanced 3D architecture and design methodology” session @DateConference on Wednesday in Antwerp Belgium.
👉For further information, please link to the PR
https://t.co/1CQCDWyUkI
Monozukuri to Present at @DateConference - 3D Design Workshop. Will demonstrate industry’s first fully integrated IC/Package Co-optimization Tool.
👉For further information, please link to the Press Release!https://t.co/9OxKVbyib2
#genio#innovation#conference#microelectronics
"Moore’s Law" Inevitable Decline Opens New Path to IC Innovation, says Monozukuri CEO and Founder, Anna Fontanelli.
👉For further information, please link to the Press Release!
https://t.co/FOWRsDa6W0
#Eda#microelectronics#innovation#tools#technologies
Monozukuri CEO Anna Fontanelli supported MiconGlobal exhibition presence @semisrael.She said that Moore's Law will come to a screeching halt,that integrating chiplet, package & system through a seamless IC/Packaging co-design methodology re-opens the path to NextGen IC Innovation
Join Anna Fontanelli, #Monozukuri Technologies Founder and CEO as she explains on Tuesday, November 29 @semisrael 2022 Expo "Why Advanced #Semiconductor Packaging and 3D Integration Matters to Everybody". 👉For more information, please visit https://t.co/iE5s2VUj3T