Ryker

[Ryker @Ryker0505]

@linda6248130564 300萬韓元，哪來的美金，死低端營銷號

[Trade Whisperer @TradexWhisperer]

$MU $SKHY $DRAM Oh no. Terrible news. The three memory makers are only projected to earn almost $1 trillion in operating income by 2029. Devastating.

[CMS Invests @cmsinvests]

THIS IS ABSOLUTELY INSANE

THE CEO OF THE WORLD’S LARGEST COMPANY JUST TOLD YOU WHAT STOCKS TO BUY TO GET RICH

LARRY FINK JUST CALLED:
- $BE AT $161.08
- $NVDA AT $191.18
- $TSM AT $377.89
- $MU AT $780.73

“THE UNITED STATES IS SHORT ON POWER, COMPUTE, CHIPS, AND MEMORY”

[P Equity Research 📰 @pequityresearch]

J.P. Morgan believes leveraged ETF unwind is complete and hedge funds are done with ~90% of deleveraging.

[Rohit @heyrohitai]

Instead of watching an hour of Netflix, watch this 2-hour Stanford lecture, which will teach you more about how LLMs like ChatGPT and Claude are built than most people working at top AI companies learn in their entire careers.

[郭明錤｜Ming-Chi Kuo @mingchikuo]

Key takeaways on TSMC's next-generation advanced packaging, CoPoS (publicly available technical details omitted):

1. CoPoS is currently expected to enter mass production in 2H28. It is designed to improve the economics of ultra-large packages above the 9.5x reticle-size class, with NVIDIA’s Feynman AI chip a potential first adopter.

2. According to industry checks, glass is used in two distinct places (dimensions in mm):
→ 310 x 310 temporary glass carriers
→ 250 x 250 (pilot) / 510 x 515 (mass production) glass panels, processed and later cut into individual glass core substrates

3. The glass core substrate is essentially a three-layer structure: a glass core sandwiched between ABF (ABF-GCP) build-up layers on both sides. The widely discussed glass processing challenges, such as TGV formation and copper filling / metallization, are tied to this part of the stack.

4. Common misconceptions about CoPoS:
→ ❌ Misconception 1: CoPoS uses a glass interposer. ⭕️ Correction: The glass is not an interposer. The interconnect role is instead handled by the chip-side RDL, plus the TGV/Cu interconnects and ABF build-up layers in the glass-core substrate stack.
→ ❌ Misconception 2: Glass replaces ABF. ⭕️ Correction: As the substrate architecture above shows, glass and ABF coexist.
→ ❌ Misconception 3: Chips sit directly on glass. ⭕️ Correction: Chips are attached to the ABF build-up surface of the glass core substrate.

5. CoPoS should extend and reinforce TSMC’s leadership in advanced packaging, potentially giving that advantage visibility through around 2032.

[Roan @RohOnChain]

https://t.co/mzc1xbkxtQ

[Morgan Stanley @MorganStanley]

Watch Hard Lessons, as legendary investor Stan Druckenmiller sits down with Morgan Stanley’s Iliana Bouzali, sharing how he would construct a portfolio if he had to start over today, why contrarianism is overrated, and which stock he regrets selling too early.

[Ryker @Ryker0505]

@BrainQuestor Fail shit

[Intl Econ Observe @IEObserve]

現在最幽默的就是Anthropic Claude code發什麼新功能，那個行業板塊就開始大規模屠殺，最新的是security。這邏輯就像是在說Claude基本上是萬能無敵，以後只需要它就夠了

目前已經消滅數兆市值了，Anthropic的估值怎麼才幾千億，一定有一方是錯的

[Rony @Ronycoder]

Claude FULL COURSE 1 HOUR (Build & Automate Anything)

[Markets & Mayhem @Mayhem4Markets]

It's actually completely insane that we're back to Great Financial Crisis levels on this NTM PE ratio between software stocks and the broader S&P 500. 🤯

There are *definitely* buying opportunities in the space.

The companies with stickier ecosystems.

$INTU is worth watching.

[Ryker @Ryker0505]

@520_lovemei @punk2898 很明顯看起來不是這樣

[Ryker @Ryker0505]

@Jaie7122Ryn @QingyanDu162548 @kiss486 你又不是中國人 幹嘛幫人家代言

[Rep. Anna Paulina Luna @RepLuna]

Friends of Taiwan: I stand with my colleagues in Congress urging the Legislative Yuan to back President Lai and fund his FULL defense budget proposal. The threat from Beijing is real and growing. America stands with Taiwan, but Taiwan must stand strong. The world is watching.

[Grant Newsham @NewshamGrant]

This congressional support is important. But too many KMT / TPP politicians are pro-PRC. More effective...cancel USA visas and green cards of KMT/TPP politicians' relatives.

[Ryker @Ryker0505]

@NewshamGrant 🇹🇼🇹🇼🇹🇼Thank you, Taiwan stand with you

[Marko Kolanovic @markoinny]

Silver is almost guaranteed to drop ~50% from these levels within a year or so. Historically episodes in commodities or various speculative assets point to that. Question is however MTM risk that can be substantial.

[Documenting ₿itcoin 📄 @DocumentingBTC]

In Seoul, South Korea, cryptocurrency trading is an E-sport where competitors buy and sell derivative markets against each other in tournaments.

[駿HaYaO @QQ_Timmy]

DRAM現貨市場買氣趨緩
本週DRAM現貨市場買氣略有趨緩，主要因前期現貨價格急漲過高，致使工廠端成本壓力大，難以承接高檔報價。加上月初部分到貨，買家多暫停手，市場氛圍轉為觀望為主。
DDR4顆粒方面，僅特定料號仍有需求，其中美光DDR4 1Gx8-3200詢單較明顯，買盤較積極；DDR4 2Gx8與1Gx16也有零星買盤，其餘DDR4品牌顆粒買氣疲弱。
模組市場方面，本週金士頓模組價格持平，但仍限量供應，可拿貨量有���。品牌模組價未再漲，但供應緊縮未改善，對現貨市場仍有支撐。

NAND Flash
鎧俠(Kioxia)部分顆粒排程長達半年
本週Wafer表現斷續，主流SK Hynix 512Gb現貨報價仍維持USD11.0，工廠端多觀望，購貨力道不強。需求有限但供應偏緊，現貨流通量少，難以大單成交。
SLC/MLC供應仍極緊，以Kioxia為例，多採排單供貨，部分顆粒排程達半年，短期現貨短缺難解。

eMMC部分，因消費端與模組端對8G/16G/32G需求升溫，各容量報價平均漲逾10%，買家搶貨積極接受高價，成交熱絡。

TF卡 整體價格相對穩定
本週TF卡需求平淡，買家問價斷續，價格穩定，目標價不高，供應端議價空間小，難成交，成交量縮減。