On the supply side, we see materials like T-glass maintain extremely strong demand across both thick products (primarily used in ABF substrates) and thin products (mainly used in BT substrates). Even TSMC underscored the impact of T-glass on CoWoS yield and reliability. We see Chinese vendors are entering aggressively in the T-glass market, expanding supply from a single source (Nittobo) to more than five suppliers, offering a glimmer of hope on the T-glass supply side. Materials are tight beyond just T-glass; substrate-level CCL has been almost solely sourced from Resonac, creating another bottleneck for substrates. Now, we are also seeing EMC make continued progress on substrate CCL. Product shipments could begin as early as 4Q26, with plans to expand its substrate CCL capacity by 100% in 2027, making a new solution available for the substrate CCL. (2/2)