@njhochman Such a decline in leadership quality.
Education is a major pillar of society.
I’ve always seen Harvard as the best school in the world. Was on my application list for MBA. Not so sure anymore.
@elonmusk@Tesla This is just an incomplete set of manufacturing files for bare PCBs and assembled PCBs.
Really open sourcing would be zipping the whole roadster design folder and sharing.
Also unlikely the real design docs are even on internally public company network.
@OpenAI I’ve been seeing way to much of Sam on my timeline. His position gave him more clout than he deserved in my opinion.
Still have respect for what he contributed. However the company seems to be prioritizing profit vs OG core values (open source AI)
@SystemgearJAPAN Depends on complexity of the design, and the type of environment you need to survive in.
High density designs will need more signal layers for routing.
Mechanical designers will want stiffer boards to help with shock and vibe, less flex in the board and fewer mounting holes
@dbrower @Italisoncv @Benathon@DatasheetDigest Probably going to remove the component for reuse, might have been a bad batch and the cost of those components made it worth the labour.
@DanSGiesbrecht Thanks for more explanation. The return path will be dependent on the frequency of the signal, which is going to be lower given some of the context you’ve provided.
Cool stuff
@DanSGiesbrecht The issue here is stack up design, and makes for poor power integrity, which is perfectly illustrated by your simulation as the density of current is in top plane coupled to the near by ground plane
Need to make either layer 3 or 4 be a ground plane and keep other the power.
@vk2tds@DanSGiesbrecht Not sure I agree with this, without knowing the dimensions of the via, and the stack up it’s still reasonable to assume each via can carry upwards of 1A