TSMC is expected to double its advanced packaging capacity by 2028 and customers are qualifying alternatives, according to Economic Daily News earlier this month
Overflow beneficiaries include:
$AMKR - announced in July that NVIDIA will prepay for Amkor's US packaging capacity expansion, while TSMC is reportedly outsourcing simpler packaging steps to them
$ASX - also a direct beneficiary of TSMC outsourcing
$INTC - Google's next TPU, Humufish, is expected to use Intel's EMIB packaging (though a TSMC backup is allegedly also being considered)
The bottleneck fad may be over for investors, but manufacturing capacity is still very much constrained