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$CPSH fundamentals did not change. Future looks promising.
Revenue grew 54% yoy.
Satellites will become very important in the future.
CPS registered a direct offering at 8$ a share, raising 9.6M new money. Now 45 days lock-up.
I’ll quote this post after one year.
$CPSH for the win 🚀
So many good reason
Revenue growth 54% YOY
Their products is stronger , lighter and accumulating more heat than all their competitors.
Strong order books.
Honestly just thinking about this make me want to hold for the next 2 years.
The demand will not stop for their products.
They just closed an offering so they already secure some cash so we should be good for a while.
Buying more $Nasa and $CPSH today.
Before a new breakout, there is always a shake out. In this market CONVICTION is key. We’ll talk within few months from now.
Blue Origin's black swan moment continues to rock the entire sector...
Highly recommend using $UFO and $NASA ETF to track the sector sentiment.
Expecting a relief bounce before $SPCX goes public. Roadshow starts very soon, should help the overall sector.
There are some solid buying zones now for great companies like $CPSH, $AMPG, $SATL, $FLY, and more.
But it's best to let the dust settle first... I'll share updates as we progress.
Call me stupid but I am not selling $CPSH .
I will follow the company through the months and we’ll get back to higher market cap soon. One big sell of today, I refuse to sell good companies at loss.
Great write up on $CPSH I currently have a 500k position at $9.50 and honestly after reading this I’m going to double that to 1 million. I believe we get to $20 by June 10th, 8 trading days.
Thermal is a likely issue for 2027-2028 GPUs:
As thermal targets escalate toward the 2000-3000W+ range, copper and aluminum becomes insufficient.
But, AlSiC, a metal matrix composite, may become important.
Here's why:
Rubin VR200 GPU pointed toward 1800W TDP, AMD Instinct MI450X, reportedly reaches up to 2500W, and $NVDA Rubin Ultra's power reportedtly goes to 2300W.
The move toward 2300W creates a heat flux problem of massive scale.
Aluminum Silicon Carbide (AlSiC) is a metal matrix composite, used as for defense, space, and high-power industrial applications (eg. high-speed rail).
Similar to how random toilet companies like Toto became critical for HBM, this material composite used for thermal management for aerospace and industrial might be used for AI as it can survive tens of thousands of thermal cycles without delamination.
So, as AI accelerators like Rubin reach power levels comparable to industrial power modules or space, the adoption of AlSiC in semiconductors may become important.
For AlSiC in 2300W systems there's:
- (Junction-to-Case): Includes the silicon die, the underfill, and the first layer of TIM
- (Case-to-Sink): Includes the heat spreader (lid) and the second layer of TIM (TIM2)
- (Sink-to-Ambient): The thermal resistance of the cold plate or liquid heat exchanger.
Case-to-Sink is likely the application for AlSiC.
And as power densities will likely continue to climb toward the 3000W mark there becomes a mechanical and thermal crisis that likely causes a material change from traditional copper packaging.
So there's four different parts to this:
1. Internal/External Thermal
It does look like SiC interposers (internal) are probably used for $NVDA Rubin gen GPUs. Then AlSiC (external) may be used for the Microchannel Lid (MLCP) or heat spreader that sits on top of the die interposer assembly.
2. 3D vertical stacking (SoIC)
These complex packages are highly vulnerable to warping during thermal cycling. A SiC interposer is a brittle crystal and it cannot provide structural rigidity. AlSiC acts as a "stiffener" that prevents the substrate from bowing under the high clamping pressures
3. Rubin Ultra NVL576 rack likely reaches high KW of power density
This density creates a weight-loading bottleneck that SiC interposers cannot solve. Rubin Ultra NVL576 rack cumulative weight of the thermal stack plus liquid manifolds can exceed the floor limits (and AlSiC may become necessary to reduce the "dead weight" of the thermal management by 60%+ without compromising heat transfer).
4. Net-Shape Manufacturing of Microchannels
Traditional copper lids must be etched or CNC-machined, a process that has reportedly encountered high mass-production difficulty for Rubin volumes.
AlSiC is manufactured using "Quickset Injection Molding" to create a ceramic preform that is then infiltrated with aluminum. This allows for the creation of complex internal geometries. AlSiC Microchannel Lids and Silicon Integrated IHS looks like the alternatives for copper for thermal management.
We might be seeing this addressed earlier in 2026 as SemiAnalysis in 2025 reported that Nvidia’s Blackwell (B100/B200) faced yield issues specifically due to warpage in the CoWoS-L packaging.
TLDR thermal is a likely a bottleneck in 2027-2028:
Some beneficiaries are potentially SiC interposers (high-purity SiC powder) and AlSiC composite for thermal management in 2027-2028.
This is all ongoing research, but maybe we'll see some extremely niche and random small railway or space AlSiC supplier be used up for AI in 1-2 years time like toilet makers for HBM.