Formation complète Claude Code 6 HEURES.
La formation Claude la plus complète d'internet.
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de A à Z : configuration, création de workflows, déploiement de sites web, création d'équipes d'agents, automatisation du navigateur, recherche de clients et tarification de vos services.
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Débutant ou avancé, tout est là en un seul endroit, ce cours couvre tout.
Ça vaut plus que tous les cours à 500$ que t’as failli acheter.
Everyone is talking about the continued #Hyperscaler Capex guidance for 2025.
Just a word of caution for supply chain companies: The incremental nominal growth in 2025 is -20% lower than it was in 2024
('24: USD +96b Vs. '25: USD +77b).
ROIC and ROCE are some of the most important metrics when it comes to successful companies
Here some of the best companies with high returns on capital💡
👇
$QTLU.TA 🇮🇱
FCF Cagr 3 years - 13%
ROIC - 47%
ROCE - 34%
$CSU.TO 🇨🇦
FCF Cagr 3 years - 15%
ROIC - 11%
ROCE - 27%
$NVDA 🇺🇸
FCF Cagr 3 years - 79%
ROIC - 63%
ROCE - 44%
$MEDP 🇺🇸
FCF Cagr 3 years - 31%
ROIC - 44%
ROCE - 50%
$NXSN.TA 🇮🇱
FCF Cagr 3 years - 130%
ROIC - 65%
ROCE - 85%
$FICO 🇺🇸
FCF Cagr 3 years - 14%
ROIC - 41%
ROCE - 56%
$KLAC 🇺🇸
FCF Cagr 3 yr - 15%
ROIC - 28%
ROCE - 33%
What are your favourites from this list and why?🤔🤔
Let me know in the comments! 👇
The ability to accurately assess pricing power might be the greatest investing superpower.
The answer to: could this business easily increase their prices & not lose customers?
…tells you so much about its product, competitors, suppliers, market position, ROIC potential, etc.
"When Markets Speak" - Best Seller on Amazon.
The Epilogue -- Chapter #1.
I was sitting there in Omaha, across the table from Charlie Munger, one of the all-time greats. I'll never forget this line. He said,
"Larry - if all you ever did was buy high-quality stocks on the 200-week moving average, you would beat the S&P 500 by a large margin over time. The problem is, few human beings have that kind of discipline."
ASML downgraded its end market forecast for 2030 by double-digits, except for servers. The incremental dollar forecast change for non-servers is even worse. This has to have some implications for non-server markets, assuming the forecast is right.
$CAMT (not holding) is a leading developer and manufacturer of high-end inspection and metrology equipment for the semiconductor industry.
The 2024-Q3 report shows growth in revenue with an optimistic forecast for 2025.
AI and Advanced Packaging as growth drivers.
"Looking ahead, the demand in the HPC segment remains healthy. We expect the overall contribution of HPC to our business this year to be around 50% and expect it to be a major growth driver in 2025 as well. We also see an increased demand for a wide range of other applications." - Rafi Amit, Camtek's CEO.
$QLTU.TA (holding) is another leading Israeli supplier of reliability test equipment and services within the semiconductor industry.
QualiTau is expanding its presence in the European and American markets. The trend of establishing and developing new semiconductor fabs in the West, alongside the CHIPS and Science Act funding, should drive further growth. QualiTau's future valuation is currently low. How low? It represents a slowdown, even in these market conditions!
Note: this is not a recommendation—do your research.
Glass core substrates will use Through Glass Vias (TGVs). They have an hourglass shape due to being created with a laser and wet HF etch combination. The geometry of the holes will be reduced by 2x to sub 0.1 mm versus organic substrates.
Also interesting here is that these now need to be Cu plated twice due to this hourglass shape. So the substrate needs to have seed + e-plating on one side, then it's flipped and the process is repeated.
source: Onto Innovation Blog
🚀 With the acceleration of HBM iterations, hybrid bonding has become a key tech as three major #DRAM manufacturers are actively evaluating its integration in #HBM4 16hi. How will this impact the #HBM business model? 💡More: https://t.co/hf564OZbP4 🔗
Dutch advanced packaging equipment maker $BESI.AS reports lower sales, but shares are up on hybrid bonding optimism
Compared to TSVs, hybrid bonding will enable improved performance and lower power consumption, per $AMAT
Read more: @BeuvingJordy
Infographic via: @SemiAnalysis_
SK Hynix showed off its latest AI memory chips, HBM3e 12H (high bandwidth memory, 12 chips stacked high) at the OCP Global Summit last week, media report, noting the chips, which are used with Nvidia’s H200 and Blackwell series, stack 12 DRAM chips together in a package the same size as older HBM3e 8H (8 chips). Each chip in the 12H version is 40% thinner than the 8H, a breakthrough enabling the total chip size to remain within system specifications. Mass production of the HBM3e 12H began in September, first in the industry. Micron said it will begin mass production of the same type of chip in early 2025. #SKhynix $MU #semiconductors #semiconductor https://t.co/7dJ8GeF5Sj