The #UALinkConsortium is returning to #SC26 in Chicago next week! Meet #UALink representatives at the SNIA Open Standards Pavilion (Booth no. 1020) and see a live UALink technology demo from @Synopsys. Learn more: https://t.co/lHrnuQqHIt
The #UALink Chiplet Specification 1.0 defines how an accelerator die connects to a UALink chiplet over #UCIe 3.0, so vendors can pair dies and chiplets from different vendors or reuse one chiplet across products. Read our blog to learn how it works: https://t.co/AmIGS0JFrH
At Apsara 2026, #UALinkConsortium member @AlibabaGroup announced its plans to use #UALink as the #ScaleUp interconnect for the Panjiu AL144 Supernode Server. Read the blog to learn more: https://t.co/sMqLlzCvNz
In-Network Compute in the #UALink Common Specification 2.0 helps reduce communication overhead, improve accelerator utilization, and enable more efficient AI #ScaleUp architectures. Read the #UALinkConsortium blog to learn more: https://t.co/viBPjaLKSQ
Watch the latest #UALinkConsortium webinar to explore the latest #UALink specifications, including In-Network Collectives, Management and Chiplet specifications, and what they mean for scalable AI infrastructure: https://t.co/9RWYlkgEUE
#UALinkConsortium is scoping #UALink 3.0, focusing on 400G data rates, optical interconnects, end-to-end resiliency, and richer management features. Read the blog to learn what’s next for UALink: https://t.co/0xf7M5I6ol
Join the #UALinkConsortium “Powering AI at Scale: Inside the UALink Ecosystem" panel today at the #OCPSummit26 to discuss real-world #UALink use cases. Learn more: https://t.co/nwRwccsTVy
Missed the #UALinkConsortium Breakfast Briefing at #AIInfraSummit? Watch the recording to hear how the latest #UALink specifications and a growing ecosystem are shaping open AI #ScaleUp: https://t.co/IpFofJAtQ7
What if the network did part of the work? The #UALinkConsortium blog, “Exploring In-Network Compute: How #UALink Is Redefining AI #ScaleUp Architecture,” explores in-network compute, which runs reductions and sync in flight inside the fabric. Learn more: https://t.co/viBPjaMiIo
Don't miss tomorrow's breakfast briefing at #AIInfraSummit: “Building the Future of AI Scale-Up,” with speakers from AMD, Astera Labs, Google, and Microchip on the growing UALink ecosystem. Learn more: https://t.co/4UMV3jRAZr
Help shape the future of open, high-performance AI #ScaleUp connectivity.
Join the #UALinkConsortium and collaborate with industry leaders advancing an open ecosystem for next-generation AI infrastructure.
Become a member today: https://t.co/ctIfnLpdl3
Join #UALinkConsortium at #AIInfraSummit for a breakfast briefing with experts from AMD, Astera Labs, Google, and Microchip about the growing ecosystem behind #UALink technology. Learn more: https://t.co/4UMV3jRAZr
#UALinkConsortium members are developing the foundational #UALink technologies needed to support the next generation of #AIInfrastructure. Read our latest blog to learn what’s coming in the UALink 3.0 specification and stay ahead of what’s next: https://t.co/0xf7M5HyyN
Visit the #UALinkConsortium (Booth no. 737) at #AIInfraSummit to see live demonstrations from @Cadence and @Synopsys highlighting the technologies advancing open, interoperable scale-up connectivity for AI infrastructure. Read our blog to learn more: https://t.co/4UMV3jR39T
Read the “Building the Future of AI #ScaleUp: Why UALink Changes the Equation” blog to learn how #UALink combines a purpose-built architecture with an open, multi-vendor ecosystem to support cost efficiency, interoperability & supply flexibility at scale: https://t.co/KQNtKTO6Rz