After a very long hiatus, @intel is once again expanding manufacturing operations in Santa Clara, right in the heart of Silicon Valley! Intel is committed to restoring American leadership in semiconductor manufacturing!
For over a decade, Intel and @Microsoft Azure have partnered to build trust in the cloud. At Microsoft Build 2026, we spoke with Azure CTO Mark Russinovich on how Azure and Intel TDX work together to support confidential cloud workloads at scale with near-zero performance overhead and minimal effort.
Watch the full interview: https://t.co/JMAqtx93Gm
Scalable, high-performance edge solutions that deliver real-time insights, efficiency, and flexibility across industries. We love to see @Supermicro advancing Edge AI with solutions powered by Intel technologies.
Building advanced semiconductors requires world-class manufacturing.
Intel Foundry fabs represent some of the most advanced manufacturing facilities in the world, bringing innovation and production together on U.S. soil.
Take a closer look in this @BusinessInsider feature: https://t.co/BL1ynLbypW
#IntelFoundry #Manufacturing
Seok-Hee Lee joins Intel as EVP, @Intel_Foundry, to lead advanced packaging and back-end manufacturing, strengthening our ability to deliver system-level innovation.
Naga Chandrasekaran will continue to lead front-end technology development, manufacturing, design enablement, and the end-to-end customer and business-facing functions that support foundry’s growth.
Navid Shahriari will retire after 37 years at Intel. His contributions helped advance Intel’s back-end technology leadership.
Learn more: https://t.co/VVXwJ6b7kZ
Intel at the @VLSI_2026 on #Intel18A-P:
- +18% lower power at iso-performance
- +9% fully routed block level performance at iso-power
- +20-40% improved thermal resistance
- new 5th logic Vt pair
- new W3P device in 180CH and 160CH
https://t.co/k59twiO0wI
Details on the new device offerings for #Intel 18A-P:
- W1 (180CH) and W1.5 (160CH) for low power
- W3P in 180CH and 160CH for higher performance
- W3P with dual contact (front side and direct backside contacts enabled by PowerVia)
I 👀 @intel winning the @Databricks Enterprise Technology Industry Award in the 2026 Databricks Customer Awards…. Congrats Eric Messenger and @StoddardCA
For more than 30 years, @Intel and @HPE have partnered to help organizations grow, scale, and thrive. Great discussions today at #HPEDiscover 2026—thank you to @jenatemple and the entire HPE team